PCB Filter Module Layout for Low-Loss Shared Antenna Integration
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Solution Overview
Problem
Existing Bluetooth and Wi-Fi modules are often implemented as independent modules, leading to increased size, insertion loss, signal distortion, and instability due to the use of lumped elements like inductors and capacitors, and the need for separate filtering of the 5 to 6 GHz band for Bluetooth antennas.
Innovation Solution
A filter module and antenna module design that integrates a low-pass filter embedded in a board, utilizing conductive pattern layers and vias to form inductors and capacitors without passive elements, allowing for reduced size and improved performance by securing sufficient inductance and reducing insertion loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a band-pass filter is implemented using lumped elements (inductor and capacitor), then the filtering function is achieved, but insertion loss increases, signal distortion rate increases, and thickness/size increases
Solution Approach 1:
The patent replaces the traditional mechanical/lumped element filter structure (inductors and capacitors as discrete components) with a distributed element filter structure implemented through conductive patterns on PCB layers. This substitution eliminates the need for physical inductor and capacitor components, thereby reducing insertion loss and signal distortion while maintaining the filtering function.
Solution Approach 2:
The patent transitions from a two-dimensional planar layout of discrete components to a three-dimensional layered structure where conductive patterns are distributed across multiple PCB layers connected by vias. This dimensional change enables the filter to achieve the required filtering performance with reduced size and improved electrical characteristics by utilizing the vertical space between layers.
2Reliability
If a band-pass filter is implemented using lumped elements (inductor and capacitor), then the filtering function is achieved, but the thickness or size increases
Solution Approach 1:
The patent utilizes the vertical dimension by distributing conductive patterns across multiple PCB layers and connecting them through vias. This layered approach allows the filter to achieve its filtering function within a compact volume, significantly reducing the overall module size compared to traditional lumped element implementations that require discrete components with substantial physical dimensions.
Solution Approach 2:
The patent merges the filter structure with the PCB itself by implementing the filter using conductive patterns on the PCB layers. This integration eliminates the need for separate discrete inductor and capacitor components, thereby reducing the overall module size and allowing the filter to be manufactured as part of the PCB assembly process.
3Adaptability or versatility
If Bluetooth and Wi-Fi modules are implemented as independent modules, then each module can function independently, but the product size increases and system stability decreases
Solution Approach 1:
The patent implements a shared antenna structure that serves both Bluetooth and Wi-Fi modules. The antenna is designed with specific characteristics (such as resonant frequencies and impedance) that allow it to operate effectively for both communication standards. This multi-functional approach enables both modules to share the same antenna, reducing the overall product size while maintaining independent functionality through software control and frequency management.
4Reliability
If a circuit is configured using passive elements for Bluetooth filtering, then the filtering function is achieved, but the size increases and price competitiveness decreases
Solution Approach 1:
The patent combines the filter function with the PCB structure by implementing the filter using conductive patterns on the PCB layers. This merging eliminates the need for separate passive components (inductors and capacitors), thereby reducing the bill of materials cost and simplifying the manufacturing process. The filter can be manufactured using standard PCB fabrication techniques, improving price competitiveness while maintaining the filtering function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the size and cost of the antenna module, enhances transmission distance and rate, and filters the 5 to 6 GHz band effectively, with insertion loss less than -3 dB, while minimizing signal distortion.
Implementation Method 1
the first conductive pattern layer may include a capacitance pattern formed to include a capacitance while facing at least one of the first ground layer or the second ground layer
Implementation Method 2
the first conductive pattern layer may include a first inductance pattern formed to include an inductance
Data Source
AI summary
A filter module is disclosed. The filter module includes a first ground layer, a second ground layer disposed so as to be spaced apart from the first ground layer, a first conductive pattern layer disposed between the first ground layer and the second ground layer, a second conductive pattern layer disposed on one side of the first ground layer or the second ground layer, and a via interconnecting at least two of the first ground layer, the second ground layer, the first conductive pattern layer, and the second conductive pattern layer.