PCB Fins on Ground Traces for Thermal Management
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Solution Overview
Problem
Printed circuit boards (PCBs) face increased heat generation due to higher current burdens, leading to resistor temperature increases and reduced lifespan of electronic components like capacitors.
Innovation Solution
A PCB design featuring fins, where first fins are directly formed on ground traces to dissipate heat from signal traces, and second fins are formed on a thermally conductive layer to enhance heat radiating efficiency, with a manufacturing method involving copper clad laminates, through holes, metal plating, and photoresist layers to create these fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If signal traces bear increased current burdens, then electronic technology developments are enabled, but heat generation increases and component lifespan is reduced
Solution Approach 1:
The patent extends the heat dissipation structure from the two-dimensional PCB surface into the third dimension by adding fins. The fins protrude from the ground traces and thermally conductive layer, creating a three-dimensional heat dissipation structure that increases surface area for heat radiation without expanding the PCB footprint.
Solution Approach 2:
The patent divides the heat dissipation function into multiple segments: ground traces serve as first heat dissipation units with fins, and the thermally conductive layer serves as a second heat dissipation unit with fins. This segmentation allows heat to be dissipated at multiple locations and through multiple pathways simultaneously.
2Temperature
If external heat sinks are used to dissipate heat, then thermal management is improved, but PCB dimensions and complexity increase
Solution Approach 1:
The patent merges the heat dissipation function with existing PCB structural elements. The fins are integrated directly into the ground traces and thermally conductive layer, which are already part of the PCB structure. This eliminates the need for separate external heat sink components and their associated mounting hardware.
Solution Approach 2:
The ground traces and thermally conductive layer serve dual functions: electrical/thermal conduction and heat dissipation. By adding fins to these existing structures, they simultaneously perform their original functions and provide enhanced radiative heat dissipation, eliminating the need for dedicated heat dissipation components.
3Temperature
If fins are added to ground traces and thermally conductive layer, then heat radiating efficiency is increased, but manufacturing complexity increases
Solution Approach 1:
The fins are formed during the PCB manufacturing process itself, before final assembly. The photoresist layers are applied and patterned to define fin shapes, and the fins are created through standard PCB fabrication steps (etching, plating) integrated into the existing manufacturing flow.
Solution Approach 2:
The ground traces and thermally conductive layer with integrated fins are self-contained heat dissipation structures that do not require external assembly or additional components. The entire heat dissipation system is built into the PCB structure itself, eliminating the need for separate heat sink assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PCB design effectively increases heat radiating efficiency and reduces the PCB's dimensions compared to external heat sinks, improving thermal management and extending the lifespan of electronic components.
Implementation Method 1
A metal plating layer 102 is formed on the inner side of each through hole 101. The metal plating layer 102 communicates the ground trace 122 and the thermally conductive layer 130, and is configured for transmitting the heat of the ground traces 122 to the thermally conductive layer 130.
Implementation Method 2
The first fins 140 are configured for dissipating heat generated by the signal traces 121. The second fins 150 are formed on the thermally conductive layer 130 to enhance heat radiating efficiency.
Implementation Method 3
The first fins 140 are configured for dissipating heat generated by the signal traces 121. The second fins 150 are formed on the thermally conductive layer 130 to enhance heat radiating efficiency.
Data Source
AI summary
A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.