PCB Flat Conductor Laser Joining for Small, Strong Contacts
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Solution Overview
Problem
Existing printed circuit board systems face challenges in achieving secure, low-resistance connections with thin and narrow conductor foils, and there is a need for compact electrical energy storage devices that can efficiently integrate multiple cells while maintaining mechanical stability and electrical performance.
Innovation Solution
A printed circuit board system with a contact surface and a flat conductor, where the conductor has a cover film, base film, and intermediate conductor film, forming a one-piece connection section in a recess, bonded together with a pulsed laser beam, allowing for secure and low-resistance connections using thinner conductor foils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional connection methods are used with thin and narrow conductor foils, then the connection area must be large to ensure sufficient strength, but this increases the overall size and reduces manufacturing precision
Solution Approach 1:
The patent changes the physical state and parameters of the conductor foil by applying laser energy, transforming it from a solid state requiring large contact area to a molten state that forms strong metallurgical bonds with the PCB contact surface, enabling strong connections with smaller connection areas
Solution Approach 2:
The patent replaces conventional mechanical connection methods (which rely on large contact areas and mechanical pressure) with laser beam welding, substituting mechanical fastening with optical-energy-based metallurgical bonding to achieve strong connections with precise, small connection areas
2Quantity of substance
If multiple electrical energy storage cells are integrated to increase capacity, then the device volume increases, but compact form factor is desired
Solution Approach 1:
The patent merges multiple electrical energy storage cells into a single integrated module, combining their functions and connections into one compact unit, thereby increasing energy storage capacity without proportionally increasing device volume
Solution Approach 2:
The patent arranges electrical energy storage cells in a nested or layered configuration within the printed circuit board system, allowing multiple cells to be integrated in a space-efficient manner that maximizes energy density while maintaining compact form factor
3Stability of the object's composition
If adhesive bonding is used between insulating layer and cover film, then mechanical stress relief is improved, but additional manufacturing steps are required
Solution Approach 1:
The patent introduces adhesive as an intermediary material between the insulating layer and cover film, which acts as a stress-absorbing layer that relieves mechanical stresses while maintaining the structural integrity of the connection assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables secure, low-resistance connections with thinner conductor foils, supports compact electrical energy storage devices, and allows for both conductor and electrical component functionality, while also providing mechanical stress relief and improved load-bearing capacity.
Implementation Method 1
the contact surface and the conductor foil are connected by means of a pulsed laser beam
Data Source
Figure 1~2
Figure 3~5
AI summary
The invention relates to a printed circuit board system (1) having a printed circuit board (8) and a flat conductor (9), wherein: the printed circuit board (8) has a contact area (3); the flat conductor (9) has a coverlay film, a base film (4), and a conductor film (5) therebetween; the conductor film (5) has a connection region (7) which is situated in a cut-out (6) in the coverlay film and the base film (4); the contact area (3) and the connection region (7) being integrally joined to each other.