PCB Flat-Spring Thermal Link for Reversible Heat Dissipation

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Solution Overview

Problem

Existing thermal connection methods for electronic components in circuit boards of batteries, such as potting compounds and thermal pads, are costly, increase weight, require additional assembly steps, and can lead to errors or incomplete connections, making them unsuitable for efficient heat dissipation and recyclability.

Innovation Solution

A printed circuit board with metallic flat springs that thermally connect electronic components to a heat-dissipating structural component, allowing flexible and reversible contact without additional components, ensuring efficient heat dissipation and ease of assembly and disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If potting compound or thermal pad is used to thermally connect electronic components to housing, then thermal connection is achieved, but device complexity and assembly effort increase

Engineering Contradiction:

Improvethermal connection qualityVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the thermal connection function with the existing circuit board structure by integrating a thermally conductive layer directly onto the circuit board. This eliminates the need for separate thermal pads or potting compound applications, reducing assembly complexity while maintaining effective thermal connection between electronic components and housing.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If thermal pad is used for thermal connection, then heat dissipation is improved, but reliability decreases due to potential slippage

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal connection stability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The thermally conductive layer is pre-integrated onto the circuit board during manufacturing, ensuring proper positioning and contact before the circuit board is installed in the housing. This preliminary integration eliminates the risk of slippage that occurs with separately applied thermal pads, as the thermal connection is already established and secured in its correct position.

Inventive Principle:

Principle #10Preliminary action

3Temperature

If potting compound is used to fill gaps, then thermal connection is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal connection qualityVSAvoidgap filling precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The thermally conductive layer is designed to automatically conform to the surface contours of the circuit board and electronic components through its flexible nature. This self-adjusting property eliminates the need for precise gap measurement and filling, as the layer adapts to irregularities in the assembly, reducing manufacturing precision requirements while maintaining effective thermal connection.

Inventive Principle:

Principle #25Self-service

4Temperature

If additional thermal connection components are added, then heat dissipation is improved, but weight increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidbattery weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The patent merges the thermal management function into the existing circuit board structure by integrating the thermally conductive layer directly onto the board. This eliminates the need for additional separate thermal management components such as thermal pads, thermal grease, or potting compound, thereby reducing overall weight while maintaining effective heat dissipation from electronic components to the housing.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The metallic flat springs provide reliable, flexible, and reversible thermal connection, reducing assembly errors and costs, enabling efficient heat dissipation and facilitating recyclability.

Implementation Method 1

The electronic component (10) is thermally conductively connected to a structural component (200) of a housing, in particular a metallic housing, via a metallic flat spring (50)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4586754A1Printed circuit board equipped with electronic components and device

Publication Date: 2025.07.16 VARTA MICROBATTERY GMBH

Figure 1~2

AI summary

A printed circuit board (100) populated with electronic components (10) is proposed for installation in a device having at least one heat-dissipating structural component (200). The printed circuit board (100) is characterized in that at least one of the electronic components (10) is thermally conductively connected to a metallic flat spring (50). The metallic flat spring (50) has a multiply bent shape with a first spring leg and a second spring leg and a central spring section. The first spring leg of the metallic flat spring (50) is fastened to the printed circuit board (100). The central spring section of the metallic flat spring (50) rests on the electronic component (10). The second spring leg of the metallic flat spring (50) is exposed and is provided to form a spring-loaded contact with the heat-dissipating structural component (200) of the device in the assembled state.Preferably, a thermally conductive layer (60) is arranged between the central spring section and the electronic component (10).