Integrated PCB Flex Circuit Interconnect Board Assembly
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Solution Overview
Problem
Existing battery module manufacturing methods lack efficient integration of printed circuit boards and flexible circuits, leading to complex and inefficient manufacturing processes, and there is a need for improved monitoring and control of battery parameters in battery systems.
Innovation Solution
The integration of a printed circuit board assembly (PCBA) with a flexible printed circuit and conductive busbars, using reflow soldering or conductive adhesives to form an interconnect board assembly that enables wireless communication with a Battery System Manager for real-time monitoring and control, along with potting or over-molding for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional separate manufacturing methods are used for PCB and flex circuit, then manufacturing process is simpler for each component, but overall manufacturing complexity increases and integration efficiency decreases
Solution Approach 1:
The patent combines the PCB and flex circuit into a single integrated assembly where the flex circuit is directly mounted onto the PCB. This merging eliminates the need for separate manufacturing and assembly processes for these two components, thereby improving manufacturing integration efficiency while reducing overall process complexity.
Solution Approach 2:
The integrated PCB-flex circuit assembly serves multiple functions simultaneously: it provides structural support, electrical connectivity, signal transmission, and mechanical mounting for battery cells. This multi-functionality consolidates what would otherwise require separate components and assembly steps, improving productivity without proportionally increasing complexity.
2Reliability
If integrated PCBA with wireless communication is implemented, then real-time monitoring and control capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent introduces a wireless communication module as an intermediary component on the PCBA that enables real-time data transmission between the battery system and external monitoring systems. This intermediary approach provides advanced monitoring capability without requiring complex hardwired connections, thereby improving reliability while managing complexity through modular integration.
Solution Approach 2:
The implementation of wireless communication transforms the monitoring system from a static, wired configuration to a dynamic, wireless one. This parameter change in communication methodology enables real-time monitoring capabilities while simplifying the physical integration compared to traditional wired approaches, thus improving reliability without proportionally increasing complexity.
3Strength
If reflow soldering process is used to join PCB and flex circuit, then joining strength and electrical connectivity are improved, but manufacturing precision requirements and process difficulty increase
Solution Approach 1:
The reflow soldering process utilizes phase transitions of the solder material (from solid to liquid and back to solid) to create strong metallurgical bonds between the PCB and flex circuit. This phase transition mechanism ensures reliable joint strength and electrical connectivity, while the controlled nature of the phase change allows for standardized manufacturing processes that manage precision requirements.
4Ease of manufacture
If conductive adhesives are used instead of soldering, then manufacturing precision requirements are reduced, but joining strength and electrical conductivity may be compromised
Solution Approach 1:
The patent explores alternative joining methods by changing the physical and chemical parameters of the bonding process. Conductive adhesives operate at lower temperatures and with different bonding mechanisms compared to soldering, reducing manufacturing precision requirements. The formulation of the adhesive is optimized to maintain adequate electrical conductivity and mechanical strength for the application, balancing ease of manufacture with joint performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach streamlines the manufacturing process, enhances the integration of battery monitoring and control, and improves the reliability and efficiency of battery module operations by enabling real-time parameter monitoring and control, thus optimizing battery performance and life.
Implementation Method 1
integrally joining the PCB and flex circuit may include subjecting the PCB and flex circuit to a reflow soldering process
Implementation Method 2
joining of the PCB and flex circuit may include using heat-cured or room temperature-cured electrically-conductive adhesive materials
Data Source
AI summary
A method of manufacturing an interconnect board (ICB) assembly for a battery module, the ICB assembly having a printed circuit board assembly (PCBA) and a carrier frame, includes depositing solder paste onto a printed circuit board (PCB) and/or a flexible printed circuit (flex circuit). The flex circuit has a conductive foil substrate coated with insulating material, and defines tabular flying leads radially-projecting from the flex circuit's periphery. The method may include positioning the PCB adjacent to the flex circuit such that the PCB and flex circuit are in direct contact along a flex interface surface of the PCB, and integrally joining the PCB and flex circuit along the interface surface to form the PCBA. The PCBA connects to the carrier frame to construct the ICB assembly. The battery module may be manufactured by connecting the ICB assembly to battery cells of the battery module.