PCB with Flexible Insulating Layers for 5G Signal Integrity
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Solution Overview
Problem
Existing materials and structures struggle to efficiently transmit high-frequency signals in the 5G era without signal loss, particularly in frequency bands of 10 GHz or more.
Innovation Solution
A printed circuit board and package design featuring a laminate with stacked insulating layers, including rigid and flexible layers, and antennas, where the flexible insulating layers are integrated to reduce signal loss by shortening transmission paths and eliminating risks at soldering joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If existing materials and structures are used for signal transmission, then manufacturing is simpler and more familiar, but signal loss occurs in high-frequency bands of 10 GHz or more
Solution Approach 1:
The patent employs composite insulating layer structures combining rigid and flexible layers with specific dielectric properties. The rigid insulating layer provides structural stability while the flexible insulating layer reduces signal loss, creating a composite material system optimized for high-frequency signal transmission above 10 GHz.
Solution Approach 2:
The patent transitions from traditional planar PCB structures to a three-dimensional stacked laminate architecture. Multiple insulating layers are vertically stacked with conductive patterns on different levels, creating a multi-dimensional signal transmission path that reduces signal loss while maintaining manageable complexity through systematic layering.
2Reliability
If soldering joints are used for connections, then assembly is straightforward, but reliability is compromised due to potential soldering joint risks
Solution Approach 1:
The patent merges the insulating layer and conductor trace into an integrated flexible insulating layer structure where conductive patterns are formed directly on the flexible substrate. This integration eliminates separate soldering joints by creating continuous conductive paths that are inherently reliable and eliminate soldering-related failure points.
Solution Approach 2:
The patent extracts and eliminates the soldering joint component from the assembly process. By forming conductive patterns directly on the flexible insulating layer and using integrated connection methods, the design removes the vulnerable soldering interface while maintaining ease of manufacture through simplified assembly procedures.
3Loss of energy
If transmission paths are long, then routing is easier, but signal loss increases
Solution Approach 1:
The patent utilizes vertical stacking of multiple insulating layers to create three-dimensional signal routing paths. Conductive patterns on different layers can be vertically aligned and connected through vias, shortening the overall signal transmission distance by utilizing the Z-dimension rather than forcing long horizontal paths on single layers.
Solution Approach 2:
The patent segments the transmission path across multiple insulating layers, with each layer containing portions of the signal route. This segmentation allows the signal to travel shorter distances on each individual layer while maintaining the complete signal path through vertical connections, reducing cumulative signal loss.
Data Source
AI summary
A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.