Flexure Sensor Integration in PCB Connection Panels
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Solution Overview
Problem
There is a need for further miniaturization and integration of sensors like accelerometers and pressure sensors on printed circuit boards to accommodate the increasing demand for smaller, more capable electronic devices without the need for surface mounting of components.
Innovation Solution
The integration of flexure members with built-in flexure sensing devices within the connection panel itself, utilizing insulating and conductive layers, allows for the production of highly sensitive acceleration and pressure sensors that can be manufactured as part of the printed circuit board, using materials like piezo-elements and resistors, and can be automated in the PCB production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If sensors are surface mounted on printed circuit boards, then sensor functionality is achieved, but device size increases and integration density decreases
Solution Approach 1:
The patent merges the sensor functionality with the printed circuit board structure itself. The flexure layer, which is part of the PCB laminate structure, serves dual purposes: providing mechanical support and enabling sensor functionality through its flexing behavior. This integration eliminates the need for separate surface-mounted sensor components, thereby reducing device size while maintaining sensor capabilities.
Solution Approach 2:
The flexure layer in the printed circuit board is designed to perform multiple functions: it provides structural support, enables mechanical flexibility, and serves as the sensing element for acceleration and pressure detection. By making the flexure layer multi-functional, the patent eliminates the need for separate sensor components, achieving both size reduction and integrated sensor functionality.
2Ease of manufacture
If discrete acoustically sensitive elements are positioned within cavities, then sensor functionality is achieved, but assembly becomes complicated and costly
Solution Approach 1:
The patent combines the sensor element with the flexure layer, which is already an integral part of the PCB laminate structure. This merging eliminates the need for separate cavity formation and discrete element positioning steps, significantly simplifying the manufacturing process while maintaining sensor functionality.
Solution Approach 2:
The sensor functionality is built into the flexure layer during the PCB laminate manufacturing process itself, before final assembly. The flexure sensing device is prepared in advance as part of the layered structure, eliminating the need for complex post-assembly operations to position discrete sensor elements.
3Reliability
If waver-based processes with flexible foils are used, then sensor functionality is achieved, but assembly becomes labor-intensive and foils are easily damaged
Solution Approach 1:
The patent merges the flexible sensing element with the rigid PCB laminate structure, creating a hybrid construction that combines the advantages of both flexible and rigid materials. The flexure layer maintains flexibility for sensing while being protected by the surrounding laminate structure, preventing damage during assembly and handling.
Solution Approach 2:
The patent uses a flexure layer that functions as a flexible element within the rigid PCB structure. This flexure layer can be made from flexible materials that are laminated between rigid layers, providing the necessary flexibility for sensing while being protected from damage by the surrounding rigid structure during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of highly integrated, cost-effective acceleration and pressure sensors that can measure directional data, providing enhanced sensitivity and precision without the need for additional component mounting, thus addressing the challenge of miniaturization and integration in electronic devices.
Implementation Method 1
The flexure member (4') carries at least a part of a flexure sensing device (6). In a preferred embodiment the flexure sensing device (6) is formed by at least one piezo-element (6').
Implementation Method 2
utilizing insulating and conductive layers, allows for the production of highly sensitive acceleration and pressure sensors that can be manufactured as part of the printed circuit board, using materials like piezo-elements and resistors
Data Source
Figure 1~2
Figure 3~4b
AI summary
In a connection panel for electronic components (1) comprising a plurality of insulating layers (8, 9, 2, 11, 12) and conductive layers (13, 14, 15) and further comprising an electronic sensor (4), the sensor (4) is comprised of at least one flexure member (4') formed by a flexure layer (2), the flexure member (4') protruding from the flexure layer (2) and into a clearance (3) within the flexure layer (2) and carrying at least a part of a flexure sensing device (6).