PCB Fluid Ejection Apparatus Printhead Embedding
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Solution Overview
Problem
Conventional substrate wide print bar assemblies face increased costs due to complex flow structures and fabrication processes required for channeling printing fluid to smaller, more tightly spaced printhead dies, which complicates the reduction of printhead die size and spacing for cost reduction in inkjet printers.
Innovation Solution
A fluid ejection structure utilizing a printed circuit board with a conductor layer, cover layer, and cavities to embed and protect printhead dies, allowing for smaller die sizes and simplified fabrication of fluid channels, enabling the use of long, narrow printhead dies and reducing the size of fluid ejection apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printhead die size is reduced to reduce cost, then die cost decreases, but the complexity of flow structures and fabrication processes increases
Solution Approach 1:
The device is segmented into distinct functional components: the printhead die is separated from the support substrate, with fluid distribution channels formed in the substrate rather than integrated into the die itself. This segmentation allows the die to be smaller and simpler while the substrate handles the complex fluid distribution function.
Solution Approach 2:
The fluid distribution channels are moved from the horizontal plane within the die to the vertical dimension, with channels formed in the support substrate that receives and distributes fluid to the die. This dimensional shift allows complex fluid distribution without increasing die size or complexity.
2Ease of manufacture
If printhead die size is reduced to reduce cost, then die cost decreases, but fabrication process complexity increases
Solution Approach 1:
The fabrication process is segmented into separate steps: forming channels in the substrate, mounting the die to the substrate, and then forming additional channels. This segmentation allows each step to be optimized independently and uses standard fabrication techniques, reducing overall process complexity despite smaller die size.
Solution Approach 2:
Fluid distribution channels are formed in the support substrate before the printhead die is mounted to it. This preliminary action simplifies the overall fabrication process by preparing the fluid distribution infrastructure in advance, allowing the die to be simply mounted without requiring complex integrated fabrication.
3Ease of manufacture
If smaller printhead dies are used, then cost is reduced, but the structures supporting the dies must change
Solution Approach 1:
The support substrate serves multiple functions: it provides mechanical support for the printhead die, contains fluid distribution channels, and acts as a mounting platform. This multi-functionality allows the support structure to accommodate smaller dies without requiring fundamental redesign, as it already performs the necessary fluid distribution and support functions.
Solution Approach 2:
The support substrate acts as an intermediary between the fluid supply system and the printhead die. It receives fluid from the supply and distributes it to the die through channels formed in the substrate, allowing the die to remain small while the substrate handles the complex fluid distribution interface.
Data Source
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AI summary
In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.