PCB Fluid Flow Channels for Component Cooling
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Solution Overview
Problem
Electronic components on printed circuit boards (PCBs) experience temperature variability due to uneven air flow, leading to higher operating temperatures for components in the center of the arrangement, which can reduce their lifespan and limit the number of components that can be installed.
Innovation Solution
Incorporating fluid flow channels into the substrate of the PCB allows electronic components to be positioned over these channels, increasing their exposed surface area to cooling fluid and enhancing heat transfer properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are arranged in close proximity to increase component density, then productivity is improved, but temperature uniformity deteriorates
Solution Approach 1:
The cooling system is segmented into multiple independent fluid flow channels that can be individually optimized. Each channel is positioned to cool specific components, allowing different cooling rates for different regions while maintaining high component density on the PCB.
Solution Approach 2:
Different regions of the PCB are provided with different cooling characteristics through localized fluid flow channels. Components generating more heat can be positioned in channels with higher flow rates or better thermal contact, while less demanding components receive appropriate cooling, achieving temperature uniformity across diverse component arrangements.
2Temperature
If components are positioned at outer edges to increase exposed surface area, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Instead of relying solely on horizontal positioning (edge vs. center), the invention introduces a vertical dimension by routing fluid flow channels beneath the PCB surface. This allows components anywhere on the board surface to access efficient cooling through the channel structure, eliminating the need to position heat-generating components at edges.
Solution Approach 2:
The fluid flow channel acts as an intermediary cooling medium that bridges the gap between components and the cooling fluid. Components can be positioned optimally for electrical and mechanical reasons while the channel structure ensures uniform heat transfer, decoupling component placement from cooling efficiency.
3Temperature
If air flow is increased to improve cooling efficiency, then temperature regulation is improved, but energy consumption increases
Solution Approach 1:
The invention transitions from gas-based air cooling to liquid-based fluid cooling. Liquid cooling channels provide superior heat transfer coefficients, enabling efficient cooling at lower flow rates and reduced energy consumption compared to high-velocity air flow systems.
Solution Approach 2:
The cooling system changes the physical parameters of the cooling medium from air to liquid, fundamentally altering the heat transfer characteristics. This parameter change enables more efficient heat removal with lower energy input, as liquids have higher specific heat capacity and thermal conductivity than gases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides more efficient cooling for all components, potentially extending their lifespan and enabling a greater number of components to be installed on the PCB by ensuring consistent and improved heat management.
Implementation Method 1
a first cooling fluid is flowed along a first surface of the substrate and through the channels
Implementation Method 2
electronic components are positioned over these channels, increasing their exposed surface area to cooling fluid and enhancing heat transfer properties
Data Source
AI summary
An embodiment of an electronic system includes a printed circuit board (PCB) including fluid flow channel extending through the PCB. In addition, the electronic system includes an electronic component including a bottom surface and positioned on the PCB over the fluid flow channel to thereby expose the bottom surface of the electronic component to fluid flow through the fluid flow channel.