PCB Connector Footprint Integrated Selective Filtering
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Solution Overview
Problem
Current printed circuit board connector footprints result in a quasi low-pass transmission response due to their design, failing to provide selective filtering, which necessitates additional filter integration, increasing manufacturing costs and board space requirements.
Innovation Solution
A modified footprint design featuring capacitive and inductive elements between transmission lines on the printed circuit board, with specific dimensions and connections to ground planes, allowing for integrated selective filtering without external components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional connector footprint is used on the printed circuit board, then the connector provides reliable mechanical connection and impedance matching, but the transmission response becomes quasi low-pass type without selective filtering capability
Solution Approach 1:
The patent merges the connector footprint with filtering functionality by integrating capacitive and inductive elements directly into the footprint structure. The capacitive element is formed between the central conductive element and ground plane, while inductive elements are created through trace configurations, combining connection and filtering functions in a single integrated structure.
Solution Approach 2:
The footprint structure serves multiple functions simultaneously: it provides mechanical support for the connector, maintains impedance matching, and creates selective filtering response. The same footprint elements that ensure reliable connection also generate the resonant circuit characteristics needed for filtering specific frequency bands.
2Adaptability or versatility
If additional external filters are integrated into the system, then selective filtering capability is achieved, but manufacturing costs and board space requirements increase
Solution Approach 1:
The patent eliminates the need for separate external filters by merging the filtering function directly into the connector footprint. The capacitive and inductive elements within the footprint form a resonant circuit that provides selective filtering, thereby reducing component count and system complexity.
Solution Approach 2:
The footprint structure is designed to perform multiple functions: mechanical support, electrical connection, impedance matching, and frequency-selective filtering. This multi-functionality eliminates the need for additional dedicated filter components, reducing both cost and complexity.
3Adaptability or versatility
If the footprint design is modified to include capacitive and inductive elements for filtering, then selective filtering is achieved, but the footprint complexity increases
Solution Approach 1:
The patent implements filtering functionality locally within the connector footprint area rather than requiring separate filter components. The capacitive element is created locally between the central conductive element and ground plane, and inductive elements are formed locally through trace configurations, maintaining compact design.
Solution Approach 2:
The patent achieves filtering by changing the electrical parameters of the footprint structure itself. By adjusting the dimensions, positions, and configurations of conductive elements and traces, the resonant frequency and filtering characteristics are controlled, allowing selective filtering without additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified footprint achieves selective filtering, reducing manufacturing costs and board space by integrating filtering functionality directly into the circuit board, enhancing transmission response and impedance matching.
Implementation Method 1
said first element forming with the first ground plane, a capacitive element
Implementation Method 2
second elements forming with the first element, a self-inductive and capacitive element
Implementation Method 3
second elements forming with the first element, a self-inductive and capacitive element
Data Source
AI summary
A printed wiring board having at least one connector includes a dielectric substrate that has, on a first face, a first ground plane, and on a second face, at least two transmission lines between which the connector and a footprint are mounted. The footprint includes a first element positioned between the two transmission lines under the connector. The first element forming with the first ground plane, a capacitive element and, at each extremity of the first element, second elements forming with the first element, a self-inductive and capacitive element. The second elements each extending by a second ground plane, the second ground planes which are connected to the first ground plane.