PCB Assembly Metal Frame Supports for Stable Board Spacing

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Solution Overview

Problem

Conventional printed circuit board assemblies face issues with deviations in the distance between the metal frame and the printed circuit board due to variations in the thickness of bonding agents, leading to potential short circuits.

Innovation Solution

A metal frame design with integral supports that are bent and extend from the plate portion to support the printed circuit board, maintaining a constant distance through a soldered connection, even with variations in bonding portion thickness and area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If bonding agents are used to bond the metal frame and printed circuit board, then bonding is achieved, but variations in bonding agent thickness cause deviations in distance between the metal frame and PCB

Engineering Contradiction:
Improvebonding strengthVSAvoiddistance consistency
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The invention divides the bonding system into two functional parts: bonding portions (containing bonding agents) positioned at corners for strong bonding, and support portions (metal extensions) positioned at center for precise distance control. This segmentation allows each part to optimize its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support portions act as intermediaries between the bonding agents and the printed circuit board. They transmit the bonding force while maintaining a predetermined distance, decoupling the bonding strength function from the distance control function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If additional structures are added to maintain constant distance, then distance consistency is improved, but device complexity increases

Engineering Contradiction:
Improvedistance consistencyVSAvoidstructural complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention merges the bonding frame and support structure into a single integrated metal frame component. The support portions are formed as integral extensions of the bonding frame, eliminating the need for separate distance-maintaining structures while achieving both bonding and distance control functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metal frame serves multiple functions simultaneously: it provides bonding surfaces at the corners through bonding portions, maintains predetermined distance through support portions, and offers mechanical support for the printed circuit board. This multi-functionality reduces the need for additional components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Strength

If bonding agent thickness is increased for stronger bonding, then bonding strength is improved, but distance consistency deteriorates

Engineering Contradiction:
Improvebonding strengthVSAvoiddistance control
Core Design Contradiction:
StrengthVSLength of moving object

Solution Approach 1:

The bonding system is segmented into corner regions with thicker bonding agents for strength, and center regions with support portions for precise distance control. This allows optimal bonding agent thickness in each region without compromising overall distance consistency.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design suppresses short circuits by ensuring a consistent distance between the metal frame and the printed circuit board, even without additional structures, thereby stabilizing the assembly.

Implementation Method 1

bonding the metal frame and the printed circuit board using a plurality of bonding portions between the metal frame and the printed circuit board

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentEP4478842B1Printed circuit board assembly and method for manufacturing printed circuit board assembly
Publication Date: 2026.03.04 SAMSUNG SDI CO LTD
  • EP4478842B1 patent drawingFigure 1
  • EP4478842B1 patent drawingFigure 2
  • EP4478842B1 patent drawingFigure 3

AI summary

A printed circuit board assembly (1000) includes a printed circuit board (100) including a plurality of support holes (110), a metal frame (200) on which the printed circuit board (100) is supported, and a plurality of bonding portions (300) between the metal frame (200) and the printed circuit board (100) that bond the metal frame (200) and the printed circuit board (100). The metal frame (200) includes a plate portion (210) opposite the printed circuit board (100), and a plurality of supports (220) integral with the plate portion (210), bent and protruding from the plate portion (210) and extending to the printed circuit board (100), each of the plurality of supports (220) being inserted into each of the plurality of support holes (110) and supporting the printed circuit board (100).