PCB Assembly Metal Frame Supports for Constant Board Spacing
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Solution Overview
Problem
Conventional printed circuit board assemblies face issues with deviations in the distance between the metal frame and the printed circuit board due to variations in the thickness of bonding agents, leading to potential short circuits.
Innovation Solution
A metal frame design with integral supports that are bent and extend from the plate portion to support the printed circuit board, maintaining a constant distance through a soldered bonding process, even with variations in bonding portion thickness and area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding agents are used to bond the metal frame and printed circuit board, then bonding is achieved, but variations in bonding agent thickness cause deviations in distance between the metal frame and printed circuit board
Solution Approach 1:
The bonding structure is segmented into multiple bonding portions distributed between the metal frame and printed circuit board. Each bonding portion independently contributes to the overall bonding strength, while the segmentation allows for more uniform stress distribution and reduced sensitivity to individual bonding agent thickness variations.
Solution Approach 2:
Different bonding portions are designed with potentially different areas and thicknesses to optimize local bonding characteristics. This allows tailored bonding strength in different regions while maintaining overall distance consistency through the distributed bonding structure.
2Device complexity
If the metal frame directly contacts the printed circuit board, then structural simplicity is achieved, but short circuits may occur due to distance variations
Solution Approach 1:
Bonding portions serve as intermediary elements between the metal frame and printed circuit board. These bonding portions maintain a controlled distance while providing electrical isolation, preventing short circuits while preserving structural simplicity by avoiding additional support components.
3Manufacturing precision
If additional structures are added to maintain constant distance, then distance consistency is improved, but device complexity increases
Solution Approach 1:
The bonding portions serve multiple functions simultaneously: they provide mechanical bonding between the metal frame and printed circuit board, maintain constant distance, and prevent short circuits through electrical isolation. This multi-functionality achieves distance consistency without requiring additional dedicated structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design suppresses short circuits by ensuring a consistent distance between the metal frame and the printed circuit board, enhancing stability and reliability without additional structures.
Implementation Method 1
bonding the metal frame and the printed circuit board using a plurality of bonding portions between the metal frame and the printed circuit board
Data Source
AI summary
A printed circuit board assembly includes a printed circuit board including a plurality of support holes, a metal frame on which the printed circuit board is supported, and a plurality of bonding portions between the metal frame and the printed circuit board that bond the metal frame and the printed circuit board. The metal frame includes a plate portion opposite the printed circuit board, and a plurality of supports integral with the plate portion, bent and protruding from the plate portion and extending to the printed circuit board, each of the plurality of supports being inserted into each of the plurality of support holes and supporting the printed circuit board.