PCB-Mounted Fuse Layout for Compact Vehicle Power Supply Control
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Solution Overview
Problem
Existing power supply control devices with blade-type fuses are not suitable for mounting on a circuit board using the reflow method due to their design, which assumes insertion into a fuse holder.
Innovation Solution
A power supply control device with a fuse that includes long plate-shaped terminals, a fusing portion connected to the terminals, and a heat-resistant housing, allowing the fuse to be mounted on a circuit board using the reflow method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a blade-type fuse is inserted into a fuse holder mounted on a circuit board, then the fuse can be easily replaced and the device is easy to operate, but the size of the power supply control device becomes large
Solution Approach 1:
The patent merges the fuse body directly with the circuit board by mounting the fuse onto the circuit board itself, eliminating the separate fuse holder. This integration reduces the overall device size while maintaining the replaceability of the fuse, as the fuse can still be removed and replaced directly on the board without requiring a dedicated holder structure.
2Productivity
If a blade-type fuse is mounted on a circuit board by soldering using the reflow method, then the manufacturing cost is reduced and productivity is improved, but the existing fuse design is not suitable for reflow mounting
Solution Approach 1:
The patent modifies the physical and thermal parameters of the fuse design to enable reflow mounting. Specifically, the fuse is designed with a heat-resistant housing that can withstand reflow soldering temperatures, and the terminals are configured to be suitable for soldering processes. This parameter change allows the fuse to be manufactured using automated reflow soldering methods, improving productivity while maintaining manufacturability.
Solution Approach 2:
The fuse incorporates a housing made of heat-resistant material that can withstand the high temperatures of reflow soldering. This composite structure combines the traditional fuse elements (terminals, fusing portion) with a thermally resistant housing material, enabling the fuse to survive the reflow manufacturing process while maintaining its protective and insulating functions.
3Ease of manufacture
If the housing is made heat-resistant to withstand reflow soldering, then the fuse becomes suitable for reflow mounting, but the manufacturing complexity increases
Solution Approach 1:
The patent selects housing materials with specific thermal properties that provide heat resistance up to the reflow soldering temperature range. By carefully controlling the material parameters (thermal stability, glass transition temperature), the housing achieves the necessary heat resistance without requiring overly complex multi-layer composite structures. This parameter optimization balances manufacturability with the required thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the fuse to be effectively mounted on a circuit board by the reflow method, reducing the size of the power supply control device and allowing for cost-effective manufacturing.
Implementation Method 1
the fusing portion is fused when a temperature of the fusing portion exceeds a predetermined temperature
Implementation Method 2
the housing is heat-resistant
Data Source
AI summary
A power supply control device is to be installed in a vehicle. The power supply control device controls power supply via a semiconductor switch and a fuse by turning the semiconductor switch ON or OFF. The semiconductor switch and the fuse are mounted on a circuit board. In the fuse, two long plate-shaped terminals are arranged in a row. The fusing portion and a part of the two terminals are covered with a housing having heat resistance. The two terminals are disposed in a current path of a current flowing through the semiconductor switch. The current flows through the fusing portion. If the temperature of the fusing portion exceeds a predetermined temperature, the fusing portion is fused.