PCB-Grooved Lens Module Layout for Reduced Camera Height
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing lens module packaging processes, particularly Flip Chip (FC), result in a relatively high height that does not meet the demands of thinner and lighter electronic products.
Innovation Solution
The lens module design incorporates recessed grooves and through holes in the printed circuit board to accommodate the filter and photosensitive chip, utilizing an FC package structure without a bracket, and includes a matte ink layer to reduce pollution, with a total height of 3.46 mm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Flip Chip (FC) packaging process is used, then signal transmission quality is improved, but lens module height becomes relatively high
Solution Approach 1:
The patent repositions the filter and photosensitive chip vertically within the PCB structure by creating recessed grooves and through-holes. The filter is placed in a first groove on one side of the PCB while the photosensitive chip is placed in a second groove on the opposite side, utilizing the third dimension (depth/vertical space) to reduce the overall height of the lens module while maintaining the FC packaging signal transmission quality
Solution Approach 2:
The patent embeds the filter and photosensitive chip within the PCB structure itself by creating recessed grooves and through-holes. The components are nested inside the PCB volume rather than being mounted on the surface, effectively using the PCB as a container structure that reduces the external height of the lens module assembly
Data Source
AI summary
A lens module with reduced height, and an electronic device carrying it, includes a lens assembly, a printed circuit board, a filter, and a photosensitive chip. The first and second opposing surfaces of the printed circuit board are each grooved to respectively hold the filter and the photosensitive chip. The existence of the first and second grooves enables a significant reduction to be made in the total height of the lens module. Moreover, the lens module adopts the FC packaging structure, not requiring a bracket, to further reduce the volume of the lens module.