PCB Ground Line Layout for Power-Line EMI Cancellation
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Solution Overview
Problem
The excessive ground current on printed circuit boards due to the placement of power lines near circuit components leads to electromagnetic interference, causing functional failures in electronic devices, and existing methods like island fill processing or all-layer fill cut processing either fail to adequately address this issue or compromise heat radiation and antenna performance.
Innovation Solution
A double-slit structure is implemented on the printed circuit board, with a ground line extending from a ground unit spaced apart along the power line, separating the area into sections to cancel out electromagnetic waves generated by the current flowing through the power line, thereby reducing electromagnetic interference and improving component functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a power line is placed near circuit components to provide power, then power supply efficiency is improved, but electromagnetic interference to surrounding components increases
Solution Approach 1:
A ground line is introduced as an intermediary element between the power line and surrounding circuit components. The ground line acts as a mediator to redirect and control the flow of return current, confining it to a controlled path that minimizes electromagnetic radiation while maintaining power supply efficiency to nearby components.
Solution Approach 2:
The ground line is strategically positioned and configured with specific local characteristics (such as proximity to the power line in certain regions and increased spacing in other regions) to create localized electromagnetic field management. This allows different sections of the circuit board to have optimized grounding characteristics tailored to their specific functional requirements.
2Object-affected harmful factors
If ground current is reduced using island fill processing or all-layer fill cut processing, then electromagnetic interference is reduced, but heat radiation performance deteriorates
Solution Approach 1:
The ground line is divided into multiple segments or sections along its length, with different segments having different configurations (such as varying widths, spacing from the power line, or connection points). This segmentation allows certain portions to optimize electromagnetic interference reduction while other portions maintain better thermal conduction paths to heat sinks or ground planes.
3Object-affected harmful factors
If ground current is reduced using island fill processing or all-layer fill cut processing, then electromagnetic interference is reduced, but antenna performance is degraded
Solution Approach 1:
The ground line configuration is optimized locally in different regions of the circuit board. In areas where antennas are located, the ground line is positioned and dimensioned to minimize interference with antenna radiation patterns while still providing effective electromagnetic shielding in other regions. This localized optimization preserves antenna performance while reducing overall electromagnetic interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double-slit structure effectively reduces electromagnetic waves and heat radiation, ensuring efficient operation of circuit components such as cameras, sensors, and communication circuits by canceling out parasitic electromagnetic waves, thus preventing functional failures.
Implementation Method 1
a ground line extending from the ground unit and disposed in the spaced area, the ground line separating the spaced area into a first section and a second section to generate an electromagnetic wave cancelling off an electromagnetic wave generated from a current flowing through the power line
Data Source
AI summary
A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.