PCB Signal Transmission Structure With Ground Notches for Impedance Control

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Solution Overview

Problem

In high-speed and high-frequency signal transmission scenarios, the low characteristic impedance of signal transmission lines, often due to limitations in board-making processes and dielectric materials, leads to increased signal reflection and reduced transmission quality.

Innovation Solution

The proposed signal transmission structure incorporates a reference ground layer with spacing grooves and notches to reduce the coupling area per unit length, thereby increasing the characteristic impedance and optimizing impedance control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the characteristic impedance of signal transmission lines is increased by using a low-Dk material or increasing the distance between the signal line and reference plane, then the impedance control is improved, but the design area is increased which reduces space utilization

Engineering Contradiction:
Improveimpedance controlVSAvoiddesign area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The reference ground layer is segmented by introducing notches that divide the continuous ground plane into discrete sections. This segmentation reduces the coupling area between adjacent signal lines and the reference ground, thereby reducing capacitance per unit length and increasing characteristic impedance without requiring additional space or material changes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The notches are strategically positioned only in specific regions where impedance control is needed, creating local modifications to the ground layer. This allows precise control of capacitance in critical areas while maintaining standard design elsewhere, optimizing space utilization without compromising overall impedance control.

Inventive Principle:
Principle #3Local quality

2Reliability

If the characteristic impedance is too low to match impedance of transmitting end and receiving end, then signal reflection is increased and signal transmission return loss is increased, but the board-making process and dielectric materials have limitations that make it difficult to achieve higher impedance

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidboard-making process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The ground layer is divided into segmented regions through notches, which reduces parasitic capacitance between signal lines and the reference plane. This segmentation approach achieves higher characteristic impedance (matching transmitting and receiving end impedance) without requiring changes to dielectric materials or complex board-making processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The notches modify the electrical parameters of the transmission line by reducing the coupling area, thereby changing the capacitance per unit length. This parameter change increases the characteristic impedance to match impedance requirements, improving signal transmission quality without complicating manufacturing.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If spacing grooves and notches are introduced to reduce coupling area per unit length, then characteristic impedance is increased, but the structure complexity is increased

Engineering Contradiction:
Improvecharacteristic impedanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The ground layer is segmented using notches that are integrated into the existing PCB fabrication process. While this creates a more complex ground pattern, the segmentation is achieved through standard manufacturing techniques, and the resulting impedance control benefits outweigh the moderate increase in structural complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The notches and spacing grooves are introduced only in specific locations where impedance control is critical, rather than throughout the entire PCB. This localized approach minimizes the overall structural complexity while achieving the necessary characteristic impedance in key signal transmission areas.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12302490B2Signal transmission structure, electronic device, and PCB
Publication Date: 2025.05.13 HONOR DEVICE CO LTD
  • US12302490B2 patent drawing
  • US12302490B2 patent drawing
  • US12302490B2 patent drawing

AI summary

A signal transmission structure, an electronic device, and a PCB. The signal transmission structure includes a reference ground layer and a signal layer disposed above the reference ground layer. The signal layer includes a plurality of signal transmission lines are disposed in parallel along a line width direction having gaps therebetween. The reference ground layer includes a first reference area, and the first reference area is an orthographic projection area, at the reference ground layer, of two of the plurality of signal transmission lines and a gap between the two signal transmission lines. The first reference area is provided with a plurality of notches, and the plurality of notches is located on an orthographic projection, in the first reference area, of the two signal transmission lines, and the notches are distributed in an array at intervals along a line length direction of the signal transmission lines.