PCB Ground Pattern Layout for Overvoltage Current Clamping
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Solution Overview
Problem
Existing printed circuit boards (PCBs) fail to ensure that current flowing through overvoltage cutoff elements sufficiently reaches the ground when an overvoltage is applied, leading to potential damage to circuit elements due to insufficient current flow to the ground pattern.
Innovation Solution
The PCB design includes a power pattern layer, a ground pattern layer, and a wiring pattern layer with a signal line pattern connected to an overvoltage cutoff element, where the ground pattern has via holes formed in specific regions to facilitate efficient current flow to the ground pattern layer, reducing impedance effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional PCB design with simple ground pattern is used, then the device complexity is reduced, but the current flow to ground becomes insufficient when overvoltage is applied
Solution Approach 1:
The ground pattern is segmented into multiple detailed patterns (first, second, and third detailed patterns) that are spatially distributed and connected through via holes. This segmentation allows the ground pattern to handle overvoltage current more effectively by providing multiple current paths, resolving the contradiction between reliability and complexity.
Solution Approach 2:
The ground pattern extends into the vertical dimension by utilizing via holes that connect different layers of the PCB. The second detailed pattern extends in a direction different from the signal line pattern, creating a three-dimensional current path that improves ground connection effectiveness without significantly increasing planar complexity.
2Reliability
If the ground pattern is extended further to improve current flow, then the overvoltage protection is enhanced, but the area occupied by the ground pattern increases
Solution Approach 1:
The ground pattern uses local quality by concentrating detailed patterns and via holes in specific regions where they are most needed for overvoltage protection. The first, second, and third detailed patterns are strategically positioned to optimize current flow paths without requiring extensive ground pattern coverage across the entire PCB.
Solution Approach 2:
By utilizing the vertical dimension through via holes that connect different PCB layers, the ground pattern achieves extended current flow paths without proportionally increasing the planar area. This dimensional transition allows compact ground pattern design while maintaining effective overvoltage protection.
3Reliability
If via holes are added to the ground pattern to improve current flow, then the impedance effect is reduced, but the manufacturing complexity increases
Solution Approach 1:
The via hole placement is segmented and strategically positioned at specific locations within the ground pattern where impedance reduction is most critical. Rather than uniformly distributing via holes throughout the entire ground pattern, they are concentrated in regions that provide maximum impedance reduction benefit while minimizing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures that current flowing through the overvoltage cutoff element sufficiently reaches the ground pattern layer, effectively clamping the applied voltage to a predetermined value, thereby protecting circuit elements from overvoltage damage.
Implementation Method 1
the PCB is designed and configured in which the PCB includes elements, such as a varistor for clamping a voltage of a signal line, to which the circuit elements are connected, to a predetermined value or less when an overvoltage is applied
Implementation Method 2
the ground pattern includes a first detailed pattern coming into contact with a second end of the overvoltage cutoff element, a second detailed pattern having the via-hole formed therein
Data Source
AI summary
The present invention relates to a printed circuit board and an image display device including same. The printed circuit board according to an embodiment of the present invention includes a power pattern layer, a ground pattern layer, and a wiring pattern layer on which circuit elements are disposed, wherein the wiring pattern layer includes a signal line pattern through which an electrical signal is transmitted, and a ground pattern electrically disconnected from the signal line pattern and having at least one via hole formed therein which is electrically connected to the ground pattern layer, wherein the signal line pattern comes into contact with a first end of an overvoltage cutoff element that operates in response to an overvoltage, greater than or equal to a predetermined voltage value, being applied to the signal line pattern, wherein the ground pattern includes a first detailed pattern coming into contact with a second end of the overvoltage cutoff element, a second detailed pattern having the via-hole formed therein, and a plurality of third detailed patterns electrically connecting the first detailed pattern and the second detailed pattern, wherein the via hole is formed in a remaining region except for a plurality of first regions of the second detailed pattern that extend from each of the third detailed patterns in a length direction of each of the plurality of third detailed patterns. Various other embodiments are possible.