Heated Circuit Board Ground-Plane Heating for Extreme Cold
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Solution Overview
Problem
Existing peripheral cards, or add-in cards (AICs), are not designed to operate in extreme cold environments, leading to component failure and inconsistent heating solutions that may void vendor warranties.
Innovation Solution
A circuit board with a copper sheet and dielectric layer, featuring openings for heating devices thermally coupled to the copper sheet, and a heater manager for temperature-controlled heating, ensuring consistent heat distribution to components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional AICs are deployed in extreme cold environments, then system cost is reduced, but components fail to operate due to insufficient heating capability
Solution Approach 1:
The heating function is segmented from the main AIC functionality and implemented as a separate heating element that can be independently controlled. This allows the AIC to maintain its original design while adding cold-weather capability through an independent heating component thermally coupled to the PCB.
Solution Approach 2:
The heating element provides preliminary heating action to the AIC components before they reach operating temperature. The system activates heating in advance when cold conditions are detected, ensuring components are warmed up before normal operation begins, preventing cold-weather failures.
2Temperature
If PCB heaters are thermally coupled to AIC heat sinks, then heating capability is improved, but the AIC design must be modified with thermal interface points and mechanical attachment features
Solution Approach 1:
The heating element is designed to thermally couple with the PCB ground plane, which serves multiple functions: electrical grounding, thermal conduction, and mechanical support. This universal interface eliminates the need for dedicated thermal interface points or mechanical attachment features on the AIC, maintaining design simplicity while providing effective heating.
3Temperature
If additional heating elements are added to the AIC, then heating capability is improved, but heat distribution becomes inconsistent throughout the card
Solution Approach 1:
The PCB ground plane acts as an intermediary thermal conductor between the heating element and the AIC components. The heating element transfers heat to the ground plane, which then distributes heat uniformly across the entire PCB area through its inherent thermal conductivity, ensuring consistent heat distribution to all components without requiring multiple heating elements.
4Ease of operation
If heating solutions are implemented without coordination with card vendor, then implementation flexibility is improved, but vendor warranty is voided
Solution Approach 1:
The heating element utilizes existing universal features of the PCB design (ground plane, copper traces, thermal pathways) that are standard in conventional AICs. By leveraging these universal thermal conduction paths rather than modifying AIC-specific components, the solution maintains vendor-approved design integrity while providing the needed heating capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient and consistent heating of components, enabling AICs to function in extreme cold environments without voiding warranties, and supports precise temperature regulation.
Implementation Method 1
A heating device is mounted within the opening and thermally coupled to the copper sheet such that energizing the heating device transfers heat to the copper sheet
Implementation Method 2
The ground plane is made of copper or another material with high thermal conductivity
Data Source
AI summary
A circuit board having one or more computer-based components comprises a ground plane, such as a copper sheet, and a dielectric layer overlaying the ground plane. An opening is defined in the dielectric layer such that an area of the ground plane is exposed. A heating device is mounted within the opening and thermally coupled to the ground plane such that energizing the heating device transfers heat to the ground plane.