PCB Ground Layout With Static Discharge Isolation at Connectors
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Solution Overview
Problem
The reduction in size of printed circuit boards and integration of ICs leads to decreased ground area for reference potential, making it difficult for noise like static electricity to escape, resulting in unstable voltage levels and increased risk of erroneous operations and damage due to static electricity.
Innovation Solution
A printed circuit board design with three ground regions - a signal ground, frame ground, and a static electricity removal ground, separated by slits, which forms a ground loop without discontinuity, to prevent static electricity from entering the signal and frame ground regions, and includes a static electricity removal ground region situated outside the connectors to discharge static electricity to the metal housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the ground area on the printed circuit board is reduced to accommodate smaller board sizes, then the board size is reduced, but the ability to escape static electricity and stabilize voltage levels deteriorates
Solution Approach 1:
The ground region is divided into multiple separate ground regions (first ground region, second ground region, third ground region) that are electrically isolated from each other by slits. This segmentation allows each ground region to serve a specific function: the first ground region handles connector connections, the second ground region serves signal processing areas, and the third ground region acts as a static electricity removal path. By segmenting the ground region, the patent maintains effective static electricity escape capability despite overall board size reduction.
Solution Approach 2:
The slits act as intermediary elements that electrically isolate the different ground regions while allowing physical proximity. These slits prevent static electricity from propagating between ground regions, serving as a mediator that protects sensitive signal areas from static electricity entering through connectors while maintaining a compact board layout.
2Volume of moving object
If the ground area is reduced due to board size reduction, then board size decreases, but voltage level stability deteriorates
Solution Approach 1:
The ground region is segmented into multiple electrically isolated regions using slits. This segmentation creates separate voltage reference zones that can maintain stable voltage levels independently, preventing voltage fluctuations from propagating across the entire board. Each ground region provides a stable reference potential for its associated components, maintaining voltage stability despite reduced overall ground area.
3Use of energy by moving object
If ICs are downsized and highly integrated to reduce power consumption and improve performance, then power consumption and size are reduced, but antistatic properties deteriorate
Solution Approach 1:
The slits serve as intermediary barriers that protect highly integrated ICs from static electricity. By placing slits between ground regions, the patent creates electrical isolation that prevents static electricity from reaching sensitive IC areas, thereby maintaining antistatic properties even as IC density increases and individual component spacing decreases.
4Reliability
If the frame ground region and signal ground region are separated by an insulation distance to prevent signal transmission, then signal interference is prevented, but static electricity protection deteriorates
Solution Approach 1:
The ground system is segmented into three distinct regions with specific functions. The first ground region (frame ground) is dedicated to connector connections and static electricity reception, the second ground region (signal ground) is dedicated to signal processing, and the third ground region provides an additional static electricity removal path. This segmentation allows each region to optimize its function without compromising the other.
Solution Approach 2:
The static electricity handling function is extracted from the signal ground region and assigned to dedicated ground regions (first and third ground regions). By taking out the static electricity reception and dissipation functions from the signal ground, the patent prevents static electricity from interfering with signal processing while maintaining effective static electricity protection through dedicated pathways.
Data Source
AI summary
A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.