Printed Wiring Board Ground Via Configuration for EMI Noise Reduction
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Solution Overview
Problem
Conventional circuit board devices are insufficient in reducing external electromagnetic noise induction, which affects the power supply voltage of IC chips, despite various design efforts to mitigate electromagnetic interference.
Innovation Solution
The design incorporates a printed wiring board with a primary layer, multiple regions for IC chip mounting, and strategically placed wiring patterns and vias that connect power supply and ground terminals to a ground layer on the opposite side, creating a configuration that isolates noise-inducing loops from the IC chip's surface, thereby preventing electromagnetic induction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If power supply and ground terminals are connected through capacitors to reduce EMI, then electromagnetic interference is reduced, but external electromagnetic noise can still be induced through loops on the surface
Solution Approach 1:
The invention moves the power supply line and ground line from the surface layer to the inner layer of the printed wiring board, utilizing the third dimension (layer depth) to reposition conductors. This dimensional transition removes the loops from the surface where they would be exposed to external electromagnetic noise, while maintaining the EMI reduction function through the capacitor connections.
Solution Approach 2:
The power supply line and ground line are nested within the inner layer of the printed wiring board, surrounded by the board structure itself. This nesting configuration protects the conductive loops from external electromagnetic interference by embedding them within the board's internal structure rather than exposing them on the surface.
2Object-generated harmful factors
If loops are present on the surface for power supply and ground connections, then EMI can be reduced through capacitor filtering, but the loops act as antennas for external noise
Solution Approach 1:
The invention extracts the power supply line and ground line from the surface layer and relocates them to the inner layer. This extraction removes the problematic loops from the surface where they would interact with external electromagnetic fields, while preserving the necessary electrical connections through vias that pass through the board.
Solution Approach 2:
The printed wiring board itself acts as an intermediary structure that houses the power supply and ground lines in its inner layer. The board's laminate structure serves as a barrier between the internal conductors and external electromagnetic noise, mediating the interaction between the electrical signals and the external environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the impact of external electromagnetic noise on the IC chip's power supply voltage, enhancing noise tolerance and preventing erroneous operations due to electromagnetic interference.
Implementation Method 1
a via that is connected to the ground line and passes through the printed wiring board
Implementation Method 2
If such a loop is subjected to the electromagnetic induction by external noise (such as electromagnetic waves or electromagnetic susceptibility (EMS), etc.), electromotive current is generated
Data Source
AI summary
A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.