Multi-layered PCB Thermal Binding via Ground Vias
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Solution Overview
Problem
Conventional printed circuit boards in camera modules are limited to single or double-sided structures due to heat transfer difficulties, restricting their ability to form multi-layered structures and mount components or signal lines effectively.
Innovation Solution
A multi-layered printed circuit board with a thermal binding system, featuring a binding part, first and second grounds, and a via for direct connection, along with a thermal binding member like solder or ACF, to facilitate efficient heat transfer and electrical connection between the camera head unit and the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-sided or double-sided PCB structure is used to transfer heat, then heat transfer capability is improved, but the ability to form multi-layered structures and mount components is worsened
Solution Approach 1:
The patent transitions from single-sided or double-sided PCB structures to a multi-layered PCB structure with four or more layers. The ground layers are strategically positioned on different sides and interconnected through vias, creating a three-dimensional thermal conduction pathway that enables effective heat transfer while maintaining multi-layered structural complexity for component mounting and signal routing.
2Device complexity
If a multi-layered PCB structure is formed, then component mounting and signal line formation capability is improved, but heat transfer capability is worsened
Solution Approach 1:
The patent merges the electrical grounding function with the thermal conduction function by using ground layers that serve both purposes. The ground layers are positioned adjacent to binding pads and interconnected through vias, creating a dual-function structure that provides both electrical reference planes and thermal conduction pathways, thereby enabling heat transfer in multi-layered configurations.
Solution Approach 2:
The ground layers act as intermediary elements between the binding pads (heat source) and the heat dissipation areas. These ground layers are positioned adjacent to the binding pads and connected through vias, serving as thermal conduits that transfer heat from the binding region to other parts of the PCB while maintaining electrical grounding functionality.
3Reliability
If ground layers are positioned away from binding pads, then signal integrity is improved, but heat transfer efficiency is worsened
Solution Approach 1:
The patent applies local quality by positioning ground layers with different characteristics in different regions. Near the binding pads, ground layers are positioned adjacent to the pads to maximize thermal conduction. In other regions, ground layers are positioned to optimize signal integrity and provide electrical reference planes. The ground layers are interconnected through vias to maintain both thermal and electrical functionality throughout the PCB structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat transfer and allows for the formation of complex signal circuits and component mounting in a multi-layered structure, enhancing the thermal binding process and performance of camera modules.
Implementation Method 1
a first ground, which is arrayed in an area heated at the time of thermal binding
Implementation Method 2
The circuit layer can include a via, which directly connects the first ground to the second ground
Data Source
AI summary
A print circuit board and a camera module having the same are disclosed. A printed circuit board of the present invention that is thermally coupled to an electronic device includes: a binding part, which has a binding pad coupled to the electronic device; a first ground, which is arrayed in an area heated at the time of thermal binding; and a second ground, which is connected to the first ground and arrayed adjacent to the binding pad. A multi-layered printed circuit board that is thermally coupled can be formed by forming a heat transfer path that is connected from the heating area to the binding pad through a ground.