PCB Grounding Spring Assembly for Vibration-Resistant Sensors
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Solution Overview
Problem
Existing sensor devices face challenges with rigid connections between Printed Circuit Boards (PCBs) that are prone to stress and fatigue due to vibrations, leading to weakened grounding and increased manufacturability complexities, especially in harsh environments.
Innovation Solution
A sensor device utilizing a flexible electrically conductive spring with a snap-fit, form-fit, or press-fit connection between PCBs, which provides both electrical grounding and strain relief without the need for soldering, using a plastic holder to secure the spring and maintain contact between the PCBs and an electrically conductive body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spring contacts are soldered onto PCBs for grounding, then electrical connection is established, but vibrations generate stress and fatigue on the solder joint, weakening the connection
Solution Approach 1:
The invention removes the solder joint from the grounding connection system. Instead of soldering spring contacts to PCBs, the patent uses a grounding element that is mechanically retained on the PCB through recesses and retaining walls, completely eliminating the solder joint that was vulnerable to vibration-induced stress and fatigue.
Solution Approach 2:
The invention introduces a grounding element as an intermediary component between the PCB and the electrically conductive body. This grounding element features a resilient portion that provides mechanical retention through recesses and retaining walls, serving as a mediator that establishes electrical connection without requiring solder joints.
2Stability of the object's composition
If rigid connection devices and multiple elements are used for PCB interconnection, then structural stability is achieved, but manufacturing complexity and assembly steps increase
Solution Approach 1:
The invention merges the grounding function with the PCB interconnection function into a single grounding element. This grounding element simultaneously provides electrical grounding and mechanically retains the PCB assembly, eliminating the need for separate rigid connection devices and reducing overall device complexity.
Solution Approach 2:
The grounding element serves multiple functions: it provides electrical grounding, mechanically retains the PCB through recesses and retaining walls, and dampens vibrations through its resilient portion. This multi-functionality reduces the number of separate components needed in the assembly.
3Object-affected harmful factors
If epoxy resin is used to fill the sensor device cavity for protection, then PCBs and electronic components are protected from harsh environments, but vibrations cannot be dampened and manufacturability is affected
Solution Approach 1:
The invention removes the epoxy resin potting process from the manufacturing system. Instead of filling the cavity with epoxy resin for protection, the patent uses a grounding element with a resilient portion that provides vibration dampening and environmental protection through its mechanical structure, eliminating the complex potting process.
Solution Approach 2:
The invention changes the material parameter from rigid epoxy resin to a resilient material for the grounding element. This resilient material provides both environmental protection and vibration dampening capabilities, improving manufacturability by eliminating the potting process while maintaining protection against harsh environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage to solder joints from vibrations, simplifies manufacturing, and enhances the reliability of electrical connections while reducing assembly costs and complexity, making it suitable for high-volume production.
Implementation Method 1
an electrically conductive spring held between the first PCB and the second PCB by a snap-fit, a form-fit or a press-fit connection. A first portion of the electrically conductive spring is pressed against one of the first PCB and the second PCB and a second portion of the electrically conductive spring is pressed against the electrically conductive body
Data Source
AI summary
A sensor device includes an electrically conductive body adapted to accommodate a first printed circuit board (PCB) and a second PCB, a flexible electrically conductive device connecting the first PCB and the second PCB, and an electrically conductive spring held between the first PCB and the second PCB by a snap-fit, a form-fit or a press-fit connection. A first portion of the electrically conductive spring is pressed against one of the first PCB and the second PCB and a second portion of the electrically conductive spring is pressed against the electrically conductive body to maintain an electrical connection between the electrically conductive body, the first PCB, and the second PCB.