PCB Guard Ring for Ion Smoke Sensor Leakage

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Solution Overview

Problem

Ion-based smoke detectors face challenges with leakage currents due to the low-level signaling used, which contaminates the signal output of the ionization chamber, particularly with the shift towards surface mount packaging that increases leakage current and incurs additional manufacturing costs and mechanical integrity issues with the bent pin/flying lead configuration.

Innovation Solution

A guard ring and notch configuration on the printed circuit board (PCB) are used to surround the ion chamber collector plate pin connection point, coupled with a surface mount component connection point and trace, minimizing leakage current by creating an air gap and using a moisture/contamination barrier to reduce both surface and bulk leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a bent pin/flying lead configuration is used with DIP IC, then leakage current is reduced, but manufacturing cost increases and mechanical integrity degrades

Engineering Contradiction:
Improveleakage currentVSAvoidmanufacturing cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent changes the packaging parameter from DIP to surface mount, and introduces a guard ring structure to compensate for the increased leakage. This parameter change allows adoption of modern surface mount technology while maintaining low leakage through the guard ring's electrical shielding effect.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The guard ring acts as an intermediary element between the ionization chamber and the PCB trace. It provides an intermediate shielding layer that blocks leakage current paths, enabling surface mount packaging without suffering from the high leakage problems that would otherwise require complex bent pin configurations.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If surface mount packaging is used, then manufacturing cost decreases and mechanical integrity improves, but leakage current increases

Engineering Contradiction:
Improvemanufacturing costVSAvoidleakage current
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The guard ring serves as an intermediary shielding structure that intercepts leakage current before it reaches the sensitive ionization chamber connection. This allows surface mount packaging to be used without directly experiencing the full leakage current problem, as the guard ring absorbs or redirects the harmful currents.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts the leakage current problem from the main signal path by introducing a separate guard ring structure. The guard ring captures and isolates the leakage current, preventing it from contaminating the ionization chamber signal, thereby enabling clean surface mount connections.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If surface mount packaging is used, then device density increases, but leakage current increases

Engineering Contradiction:
Improvedevice densityVSAvoidleakage current
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The guard ring provides an intermediary protective layer that enables dense surface mount packaging while preventing leakage current from affecting the ionization chamber. The guard ring's shielding effect decouples the density advantage of surface mount from its leakage disadvantage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9913366B2PCB trace connection of ion smoke sensor
Publication Date: 2018.03.06 KIDDE WALTER PORTABLE EQUIPMENT INC
  • US9913366B2 patent drawing
  • US9913366B2 patent drawing
  • US9913366B2 patent drawing

AI summary

Embodiments are directed to a method for manufacturing a smoke detector, comprising: manufacturing a substrate that comprises a guard ring configured to surround an ion chamber collector plate pin connection point, a surface mount component connection point, and a trace coupling the ion chamber collector plate pin connection point and the surface mount component connection point, and coupling a surface mount component to the substrate at the surface mount component connection point.