PCB Heat Dissipation Structure in Ventilated Display Assemblies
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Solution Overview
Problem
Display devices face challenges in effectively dissipating heat from high heat-generating components, leading to temperature concentration and potential damage, especially in the non-active areas where heat dissipation is inadequate.
Innovation Solution
Incorporating a combination of vent holes and heat dissipation fins on the cover shield and plate bottom, which are designed to disperse and dissipate heat away from the printed circuit board, reducing the risk of overheating and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to protect the printed circuit board, then thermal management is improved, but device complexity increases
Solution Approach 1:
The cover shield is integrally formed with the cover bottom to create a unified heat dissipation structure, combining protection and thermal management functions into a single component that reduces overall device complexity while maintaining effective heat dissipation
Solution Approach 2:
The cover shield serves multiple functions simultaneously: it protects the printed circuit board from physical damage, dissipates heat through integrated fins, and provides structural support, thereby reducing the need for separate components
2Temperature
If vent holes and heat dissipation fins are added to the plate bottom, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The plate bottom is divided into functional zones with strategically positioned vent holes and heat dissipation fins, allowing heat to be dissipated through multiple pathways while maintaining a relatively simple overall manufacturing process
Solution Approach 2:
Heat dissipation features are concentrated in specific high-heat areas of the plate bottom rather than uniformly distributed, optimizing thermal management where most needed while minimizing manufacturing complexity in other regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the maximum temperature on the display panel's surface by approximately 3.1°C, enhancing heat dissipation efficiency and protecting the printed circuit board from thermal damage.
Implementation Method 1
a plurality of first vent holes and a plurality of first heat dissipation fins may be disposed in a part of the plate bottom
Implementation Method 2
heat dissipation fins for dissipating heat are configured on a cover shield and plate bottom
Data Source
AI summary
A display device according to an exemplary embodiment of the present disclosure includes a display panel in which an active area and a non-active area are defined. The display device includes a cover bottom which supports the display panel on a rear surface of the display panel. The display device includes a plate bottom disposed in an opening of the cover bottom. The display device includes a printed circuit board disposed on a rear surface of the plate bottom. The display device includes a cover shield disposed to cover the printed circuit board on the rear surface of the cover bottom. A plurality of first vent holes and a plurality of first heat dissipation fins are disposed in a part of the plate bottom, thereby effectively discharging the heat of a heat generating unit.