PCB Heat-Dissipation Structure for High-Density Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing PCBs face challenges in efficiently dissipating heat from components with relatively smaller dimensions and higher heat density, such as diodes, due to limited air conduction, which complicates maintaining safe operating temperatures.
Innovation Solution
A heat dissipating device featuring arms and flanges or a trapezoidal housing extending from the PCB trace, which interacts with airflow from a fan to enhance heat dissipation, or a heat pipe with flanges and a heat sink to facilitate faster heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air conduction through the PCB is used for heat dissipation, then the structure remains simple, but heat dissipation efficiency is insufficient for high heat density components
Solution Approach 1:
The patent transitions from two-dimensional copper trace heat conduction on the PCB plane to three-dimensional heat dissipation structures (protrusions extending upward, fins, and heat sinks) that utilize vertical space. This dimensional expansion significantly increases the heat dissipation surface area without complicating the base PCB structure, allowing efficient heat removal from high-density components while maintaining manufacturing simplicity.
Solution Approach 2:
The heat dissipation function is segmented into multiple independent components: copper traces for initial heat collection, protrusions for vertical heat transfer, fins for expanded surface area, and heat sinks for final dissipation. This segmentation allows each component to be optimized for its specific function while collectively solving the heat dissipation problem without requiring complete structural redesign.
2Productivity
If smaller dimension components with higher heat density are used, then component integration increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent applies different heat dissipation structures to different locations based on local heat generation characteristics. High heat density components receive dedicated protrusions with fins and heat sinks, while other areas use standard copper traces. This localized approach ensures that each component receives appropriate heat management without over-engineering the entire PCB, maintaining high component integration while effectively managing local temperature challenges.
3Device complexity
If traditional copper traces are used for heat dissipation, then the PCB layout remains unchanged, but heat removal from high density components is insufficient
Solution Approach 1:
The patent merges multiple heat dissipation mechanisms into a unified system: copper traces for heat collection, protrusions for vertical heat transfer, fins for surface area expansion, and heat sinks for final dissipation. This combination allows the system to maintain the simplicity of traditional PCB layouts while incorporating advanced heat removal techniques, achieving both layout simplicity and effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively reduces the temperature of heat-generating components from above 200°C to below 140°C, maintaining safe operating conditions and allowing for cost-effective installation without altering the PCB layout.
Implementation Method 1
an arm extending from a trace of the PCB proximate a heat generating component; and a plurality of flanges extending from the arm, wherein air flowing from a fan disposed on the PCB interacts with the plurality of flanges causing the plurality of flanges to remove heat from the heat generating component
Implementation Method 2
air flowing from a fan disposed on the PCB interacts with the plurality of flanges causing the plurality of flanges to remove heat from the heat generating component
Data Source
Figure 1A
Figure 1B~1D
Figure 2A
AI summary
A heat dissipating device configured to dissipate heat generated by heat generating components of a PCB includes: an arm extending from a trace of the PCB proximate a heat generating component; and a plurality of flanges extending from the arm, wherein air flowing from a fan disposed on the PCB interacts with the plurality of flanges causing the plurality of flanges to remove heat from the heat generating component.