Heat Dissipation Device Grounding for PCB Noise Control
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Solution Overview
Problem
High-frequency noise generated by processing chips during high-clock operations is radiated through heat dissipation devices, causing electromagnetic interference due to their non-conductive connection to the circuit board, leading to system instability.
Innovation Solution
A heat dissipation device with a conductive element connected to both the heat dissipation element and the bare metal area of the circuit board, grounding the heat dissipation element to eliminate high-frequency noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation devices are added to processing chips, then heat accumulation is resolved, but electromagnetic interference occurs due to high-frequency noise radiation through heat dissipation fins
Solution Approach 1:
A conductive element is introduced as an intermediary between the heat dissipation element and the circuit board's bare metal area. This conductive element provides a controlled electrical connection path that grounds high-frequency noise while maintaining the heat dissipation function, thereby resolving the electromagnetic interference caused by the heat dissipation fins acting as antennas.
2Temperature
If heat dissipation fins are disposed without conductive connection to circuit board, then heat dissipation function is achieved, but high-frequency noise has no elimination path and radiates as electromagnetic interference
Solution Approach 1:
The heat dissipation element, which originally acts as an unwanted antenna for high-frequency noise, is converted into a beneficial component by establishing a conductive connection to ground. This allows the same structure to continue dissipating heat while simultaneously providing a path to channel and eliminate high-frequency noise, transforming a harmful function into a useful one.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents electromagnetic interference by grounding the heat dissipation element, ensuring stable system operation by eliminating high-frequency noise radiation.
Implementation Method 1
The conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively
Implementation Method 2
heat dissipation element disposed on the chip
Data Source
AI summary
A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.