PCB Heat Dissipation via Integrated Through Holes and Ground Traces
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) with heat sinks for electronic devices are costly and time-consuming to fabricate, necessitating a novel PCB structure with integrated heat dissipation capabilities that eliminates the need for a heat sink.
Innovation Solution
A PCB structure featuring a package substrate with a landing pad, ground traces, and strategically placed through holes that function as heat dissipation elements, allowing for thermal conduction and diffusion of heat away from semiconductor chips without the need for a conventional heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat sink is used for heat dissipation, then heat dissipation effectiveness is improved, but fabrication cost and time increase
Solution Approach 1:
The patent merges the heat dissipation function into the PCB substrate itself by creating a thermal path structure integrated with the substrate, ground traces, and solder joints. This eliminates the need for a separate heat sink component while achieving effective heat dissipation from the semiconductor chip through the PCB's internal structure.
Solution Approach 2:
The PCB substrate is designed to perform multiple functions simultaneously: electrical connection, mechanical support, and heat dissipation. The thermal path structure within the substrate serves as both a structural element and a thermal conduction pathway, allowing the PCB to dissipate heat without requiring an additional dedicated heat dissipation component.
2Temperature
If a heat sink is integrated with the PCB, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing PCB substrate structure rather than adding a separate heat sink. The thermal path is created within the substrate layers, utilizing existing materials and structures to conduct heat away from the chip, thereby maintaining simple device architecture.
Solution Approach 2:
The PCB substrate itself serves as the heat dissipation mechanism through its integrated thermal path structure. The substrate's own materials and geometry are configured to conduct heat efficiently, allowing the PCB to perform heat dissipation as an inherent function without requiring external heat sink components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed PCB structure effectively dissipates heat generated by electronic devices, enhancing operational stability while reducing fabrication costs and time by eliminating the requirement for a separate heat sink.
Implementation Method 1
a first through hole formed through the landing pad and the package substrate from substantially a center portion of the bonding pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the bonding pad
Data Source
AI summary
A printed circuit board (PCB) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of ground traces formed over various portions of the package substrate, physically connecting to the bond pad from at least two of the corners thereof, respectively; a first through hole formed through the landing pad and the package substrate from substantially a center portion of the bonding pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the bonding pad, wherein the second through holes are adjacent to the ground traces, respectively.