PCB Heat Dissipation Structure With Solder Domes for Stable Gap Control
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Solution Overview
Problem
Existing printed circuit boards face challenges in stable heat dissipation, corrosion prevention, electrical short prevention, and design flexibility due to issues with thermal interface materials and bead collapse, which affect the performance and reliability of electronic control elements in vehicles.
Innovation Solution
A heat dissipation structure for printed circuit boards that includes heat dissipation holes, thermal interface material, beads, and solder domes to maintain a minimum gap or thickness, preventing contact and ensuring stable heat dissipation and electrical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If beads are used to form a gap between the printed circuit board and heat sink, then corrosion prevention is improved, but the gap thickness becomes unstable due to bead collapse
Solution Approach 1:
Solder domes are formed in advance on the printed circuit board before heat sink assembly. These pre-formed solder domes serve as stoppers that prevent bead collapse and maintain stable gap thickness, while the beads still provide corrosion protection by preventing direct contact between the heat sink and PCB.
2Temperature
If thermal interface material is applied between the printed circuit board and heat sink, then heat dissipation is improved, but the minimum thickness cannot be secured when beads collapse
Solution Approach 1:
Solder domes are formed in advance on the printed circuit board to serve as height reference and stoppers. These pre-formed structures ensure that when thermal interface material is applied, a minimum thickness is maintained even if beads collapse, thereby preserving heat dissipation performance.
3Device complexity
If a simple heat dissipation structure is used, then manufacturing complexity is reduced, but electrical short prevention becomes unreliable
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: solder domes serve both as electrical insulation barriers to prevent shorts and as mechanical stoppers to maintain gap thickness. This merging of functions achieves reliable electrical short prevention without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively stabilizes heat dissipation, prevents corrosion and electrical shorts, and enhances design freedom by maintaining a secure gap and thickness, improving the reliability and performance of electronic devices.
Implementation Method 1
a thermal interface material arranged between the second surface of the printed circuit board and a first surface of the heat sink
Implementation Method 2
at least one solder dome disposed on the second surface of the printed circuit board so that a minimum gap between the printed circuit board and the heat sink is secured upon the bead collapsing
Data Source
AI summary
A heat dissipation structure of a printed circuit board in which a heating element is disposed on one surface thereof and a heat sink is disposed on another surface thereof is provided, The heat dissipation structure includes a heat dissipation hole passing through the printed circuit board in a thickness direction of the printed circuit board, a thermal interface material arranged between the other surface of the printed circuit board and one surface of the heat sink, a bead interposed between the other surface of the printed circuit board and the one surface of the heat sink to form a gap between the printed circuit board and the heat sink, and at least one solder dome disposed on the other surface of the printed circuit board so that a minimum gap between the printed circuit board and the heat sink is secured when the bead collapses.