PCB Heat Pipe Layout for Cooling Multiple Integrated Circuits
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Solution Overview
Problem
Electronic devices with multiple integrated circuits (ICs) face temperature disparities, necessitating effective heat dissipation to maintain optimal operating conditions.
Innovation Solution
Incorporation of a heat pipe surrounding multiple ICs on a printed circuit board (PCB), connected to a heat sink, with a mesh plate and fan system to enhance heat transfer and dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat pipe surrounds multiple ICs to dissipate heat, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated heat pipe structure that surrounds multiple ICs simultaneously. The heat pipe integrates heat collection from multiple sources (first IC, second IC) and heat dissipation to the heat sink in one unified component, improving cooling efficiency while managing device complexity through functional integration.
Solution Approach 2:
The heat pipe serves multiple functions: it collects heat from the first IC, collects heat from the second IC, and dissipates heat to the heat sink. This multi-functional design allows a single component to address thermal management needs of multiple heat-generating elements, improving overall system reliability without proportionally increasing complexity.
2Temperature
If a heat pipe structure is added to dissipate heat from multiple ICs, then temperature control is improved, but manufacturing complexity increases
Solution Approach 1:
The heat pipe extends in multiple spatial dimensions to contact both the first IC and the second IC, which are positioned at different locations on the PCB. By utilizing three-dimensional spatial arrangement, the heat pipe achieves comprehensive thermal coverage of multiple ICs without requiring multiple separate heat dissipation components, thereby improving temperature control while managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively disperses heat from multiple ICs, maintaining optimal operating temperatures and improving cooling efficiency through diverse heat paths and airflow management.
Implementation Method 1
a heat pipe including a first portion on the first surface, respectively connected to the first IC and the second IC, surrounding the first IC and the second IC when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink
Implementation Method 2
The heat pipe including a first portion on the first surface, respectively connected to the first IC and the second IC
Implementation Method 3
with a mesh plate and fan system to enhance heat transfer and dispersion
Data Source
AI summary
An electronic device is provided. The electronic device includes a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface. The electronic device includes a processor on the second surface. The electronic device includes a heat sink on the second surface, partially contacted on the processor. The electronic device includes a first integrated circuit (IC) on the first surface. The electronic device includes a second IC on the first surface spaced apart from the first IC. The electronic device includes a heat pipe including a first portion surrounding the first IC and the second IC when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink.