Embedded PCB Heat Radiating Member for Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional printed circuit boards (PCBs) face limitations in continuous heat radiation due to the narrow size of heat emission paths, restricting the amount of heat that can be efficiently dissipated from embedded electronic elements.
Innovation Solution
A printed circuit board design featuring a first substrate with an element accommodating portion and laminated second substrates on its outer surfaces, where a heat generating element is embedded with a heat radiating member, such as a copper heat sink, directly coupled to a heat radiating pad on the wiring layer, allowing for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a via is used to convey heat from the embedded electronic element, then heat radiation is achieved, but the heat radiation capability is limited due to the narrow size of the via and heat emission path
Solution Approach 1:
The patent transitions from conventional 2D surface mounting to 3D embedded mounting, allowing the electronic element to be positioned within the substrate thickness. This enables the heat radiating member to extend through multiple layers and connect to wiring layers at different depths, creating a three-dimensional heat dissipation pathway that overcomes the limitations of narrow surface vias.
Solution Approach 2:
The patent introduces a heat radiating member as an intermediary component between the electronic element and the wiring layers. This mediator facilitates efficient heat transfer by providing a dedicated thermal conduction path through the substrate, bypassing the need for narrow vias and enabling continuous heat radiation from the embedded element.
2Volume of moving object
If the electronic element is embedded in the substrate, then miniaturization is achieved, but heat dissipation becomes difficult due to the narrow heat emission path
Solution Approach 1:
The patent implements a nested structure where the electronic element is positioned within a cavity formed in the substrate, and the heat radiating member is embedded within the substrate layers. The heat radiating member extends through multiple substrate layers and connects to wiring layers at different levels, creating a nested configuration that enables effective heat dissipation while maintaining compact dimensions.
Solution Approach 2:
The invention utilizes the vertical dimension by allowing the heat radiating member to extend through the substrate thickness and connect to wiring layers at different depths. This 3D approach to heat dissipation overcomes the narrow heat emission path problem associated with 2D surface mounting, enabling efficient thermal management in miniaturized devices.
3Temperature
If the heat radiating member is disposed in the second substrates, then heat radiation efficiency is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent employs preliminary action by forming cavities and positioning the heat radiating member during the substrate lamination process, before final curing. The manufacturing method includes forming a cavity in the substrate, positioning the electronic element with the heat radiating member in the cavity, and then curing the filling material to fix the element in place, integrating heat dissipation structure formation with the base substrate fabrication.
Solution Approach 2:
The manufacturing process utilizes nested doll by embedding the electronic element and heat radiating member within the substrate layers during the lamination process. The heat radiating member is positioned within the cavity and extends through the substrate layers, allowing it to be integrated into the multi-layer structure without requiring separate post-processing steps for heat dissipation pathway creation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases heat radiating efficiency, enabling the embedding of high heat-generating components like power amplifiers in PCBs by effectively dissipating heat through the heat radiating member and pad, overcoming the limitations of conventional heat dissipation methods.
Implementation Method 1
a heat radiating member coupled to an inactive surface of the heat generating element... the heat radiating member may be directly coupled to one of the wiring layers... heat radiating efficiency
Data Source
AI summary
A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.