PCB Assembly Heat Radiating Structure for Compact Cooling
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Solution Overview
Problem
Existing heat sinks for electronic components in printed circuit boards hinder miniaturization, weight reduction, and thinness while providing inadequate heat radiation performance.
Innovation Solution
A printed circuit board assembly with a heat radiating member that contacts the electronic component, featuring connection parts to transfer heat to the board, and a ground layer for enhanced heat dissipation, utilizing thermal interface materials and radially disposed connection parts to avoid interference with wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large-sized heat sink with many heat radiation fins is used to increase heat radiating performance, then heat radiation efficiency is improved, but device size and weight increase
Solution Approach 1:
The patent combines the heat sink with the printed circuit board by integrating heat radiation fins into the PCB structure itself, eliminating the need for a separate heat sink component. This merging reduces overall device weight while maintaining heat radiation capability through the integrated fins that extend from the PCB surface.
Solution Approach 2:
The printed circuit board is designed to serve dual functions: electrical connectivity and heat radiation. The PCB incorporates heat radiation fins as part of its structure, allowing it to function both as the circuit carrier and as the primary heat dissipation component, thereby eliminating the need for dedicated heat sink hardware.
2Temperature
If a large-sized heat sink is used to increase receptible thermal capacity, then heat absorption capacity is improved, but device miniaturization is hindered
Solution Approach 1:
The heat sink functionality is merged into the PCB structure through integrated heat radiation fins, eliminating the need for a separate bulky heat sink component. This integration achieves the required thermal capacity within the existing PCB volume, supporting device miniaturization.
Solution Approach 2:
Instead of increasing heat sink volume in three dimensions, the patent utilizes the PCB's surface area and extends fins perpendicular to the board surface, effectively using the vertical dimension for heat radiation while keeping the footprint compact. This dimensional approach maintains thermal capacity without increasing overall device volume.
3Temperature
If a heat sink is added to improve cooling, then heat radiation performance is improved, but device complexity increases
Solution Approach 1:
The heat sink is merged with the PCB as a single integrated structure rather than being a separate component. This eliminates the need for additional mounting hardware, thermal interface materials, and assembly steps, thereby reducing device complexity while maintaining heat radiation performance.
Solution Approach 2:
The PCB is designed to perform multiple functions simultaneously: electrical signal transmission and heat radiation. By making the PCB itself the heat dissipation component through integrated fins, the design eliminates the need for separate cooling system components and simplifies the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat radiating performance while maintaining miniaturization and preventing component malfunctions, ensuring efficient heat transfer and protection from overheating.
Implementation Method 1
a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component
Implementation Method 2
at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board
Implementation Method 3
The heat sink cools the electronic component by convecting the heat generated from the electronic component to the air
Data Source
Figure 1
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Figure 4~6
AI summary
A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.