Multi-layer PCB Heat Radiation Pattern for Semiconductor Cooling
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Solution Overview
Problem
Heat interference occurs between semiconductor elements and magnetic parts with coiled patterns on printed circuit boards, especially when the area is reduced, leading to inefficient cooling and increased temperature.
Innovation Solution
A multi-layer printed circuit board with a magnetic part formed by a magnetic core and coil pattern, featuring heat radiation patterns connected to screw fixing portions that directly connect to a cooler for enhanced heat conduction and electrical conductivity, allowing for closer placement of semiconductor and magnetic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the area of the printed circuit board is reduced and components are positioned closer together, then the board area is minimized, but heat interference between semiconductor elements and coil patterns increases
Solution Approach 1:
The invention divides the board into multiple layers with heat radiation patterns on different layers (first outer layer, second outer layer, and inner layers) to segment the heat dissipation paths. This allows heat from closely positioned components to be radiated through multiple separate paths, reducing heat interference while maintaining compact board area.
Solution Approach 2:
The invention utilizes the third dimension (vertical stacking of multiple layers) to resolve the heat interference problem. By placing heat radiation patterns on both outer layers and inner layers, heat can be dissipated in multiple spatial dimensions rather than being confined to a single plane, enabling closer component placement without excessive heat interference.
2Object-affected harmful factors
If heat radiation patterns are added between components, then heat interference is suppressed, but device complexity increases
Solution Approach 1:
The heat radiation patterns serve multiple functions: they radiate heat from semiconductor elements, provide electrical connection paths, and can be integrated with existing circuit patterns. This multi-functionality reduces the need for separate dedicated heat dissipation structures, thereby limiting the increase in device complexity.
Solution Approach 2:
The invention merges the heat radiation function with existing circuit patterns and wiring structures. By combining heat radiation patterns with circuit traces and utilizing existing via holes and connection points, the design avoids adding completely separate complexity while achieving effective heat interference suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses heat interference between components, enabling them to be placed closer together while maintaining efficient heat dissipation, thus reducing the board's area and improving cooling performance.
Implementation Method 1
the heat radiation pattern, the screw fixing portion, and the cooler are directly connected in a manner that gives heat conductance and electrical conductance to the heat radiation pattern, the screw fixing portion, and the cooler
Implementation Method 2
a cooler placed on an opposite side from a mounting surface of the multi-layer printed circuit board
Implementation Method 3
a cooler placed on an opposite side from a mounting surface of the multi-layer printed circuit board
Data Source
AI summary
In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.