PCB Heat Sink Partition Layout for Dense Circuit Cooling
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Solution Overview
Problem
The existing capacitor design in PTL 1 lacks effective heat dissipation performance, as heat generated from the capacitor element is primarily transferred to the electrode plate and lid body, with the other surface not contributing significantly to heat dissipation.
Innovation Solution
A circuit device incorporating a first heat sink with partition plates and a sealing material that thermally and mechanically bonds circuit components, enhancing heat dissipation through a parallel-cross pattern of partition plates and a printed wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is improved by adding heat sinks and partition plates, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat sink surface is segmented into multiple regions by first partition plates extending in a first direction and second partition plates extending in a second direction orthogonal to the first direction. This segmentation divides the heat dissipation surface into multiple independent zones, allowing heat from different circuit components to be dissipated through separate pathways, thereby improving overall heat dissipation performance while maintaining manageable structural complexity through systematic division.
Solution Approach 2:
The partition plates extend in two orthogonal directions (first direction and second direction) on the heat sink surface, creating a two-dimensional grid pattern. This dimensional approach maximizes the use of the heat sink surface area for heat dissipation by utilizing both horizontal and vertical orientations, effectively increasing the heat dissipation capacity without proportionally increasing structural complexity.
2Volume of moving object
If circuit components are densely arranged to reduce device size, then device size is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat sink surface is divided into multiple independent heat dissipation zones by partition plates extending in orthogonal directions. This segmentation allows circuit components to be densely arranged on the PCB while each component's heat can be independently dissipated through its designated zone, preventing heat accumulation and maintaining heat dissipation efficiency even with high component density.
Solution Approach 2:
Different regions of the heat sink surface are assigned to different circuit components through the partition plate arrangement. Each local region provides optimized heat dissipation for its corresponding component, allowing the heat sink structure to adapt to the specific thermal requirements of densely packed circuit components without requiring a uniformly large device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The circuit device improves heat dissipation performance, doubling the service life of components like capacitors and inductors at reduced temperatures, reduces temperature differences among components, and enhances electromagnetic shielding and vibration resistance.
Implementation Method 1
The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed inside the sealing material, and thermally and mechanically bonded.
Implementation Method 2
A circuit device of the present disclosure includes a first heat sink having a first upper surface, a plurality of first partition plates and second partition plates attached to the first upper surface
Implementation Method 3
heat generated from the capacitor element is transferred to the electrode plate and the lid body on a lower surface
Data Source
AI summary
A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direction orthogonal to the first direction. The second partition plates extend in a third direction orthogonal to the first direction and the second direction. The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed in the sealing material. The printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.