PCB Heat Sink Fastening Structure for Low-Profile Mounting
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Solution Overview
Problem
The existing methods for fastening heat sinks to printed circuit boards (PCBs) either increase the product thickness when using push pins or compromise heat transfer efficiency when using screws, and there is a need to reduce the overall thickness of electronic products while maintaining effective heat dissipation.
Innovation Solution
A heat sink fastening structure that incorporates a push pin with an elastically deformable head portion, a through hole, and an accommodating hole on the PCB, allowing the head portion to penetrate and be fixed to a bracket, utilizing an elastic member to secure the push pin to the bracket, thereby reducing product thickness without compromising heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If push pins are used to fasten the heat sink to the PCB, then the heat sink can be securely fastened, but the head portion of the push pin protrudes from the lower end of the PCB, increasing the overall product thickness
Solution Approach 1:
The head portion of the push pin is nested within an accommodating hole formed on the PCB, allowing the heat sink to be fastened securely while the head portion does not protrude from the PCB, thereby reducing the overall product thickness
Solution Approach 2:
The solution moves the head portion accommodation from a vertical protrusion dimension to a horizontal embedding dimension within the PCB thickness, effectively reducing the overall z-axis thickness of the product
2Length of stationary object
If screws are used to fasten the heat sink to the PCB, then the height is reduced, but the heat transfer efficiency changes depending on the torque amount, which may cause the chip to break
Solution Approach 1:
The push pin structure with elastic member provides self-regulating fastening where the elastic member automatically adjusts to the appropriate clamping force, eliminating the need for precise torque control and preventing chip damage from excessive tightening
Solution Approach 2:
The elastic member changes its physical state from uncompressed to compressed, providing a progressive and self-limiting fastening force that prevents excessive torque from damaging the chip while maintaining secure attachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a reduced product thickness while maintaining effective heat dissipation by securely fastening the heat sink to the PCB, ensuring the head portion is accommodated within the PCB, preventing protrusion and enhancing the structural integrity of the electronic product.
Implementation Method 1
an elastic member provided between the push portion and the heat sink... When a force is applied to the push portion, an end portion of the head portion may be inserted into the through hole while the elastic member is compressed, and the head portion inserted into the through hole may penetrate the through hole by being elastically deformed to become smaller in size... When the force applied to the push portion is released, the push portion may be moved in a direction opposite to a direction in which the force is applied to the push portion together with the head portion by an elastic force of the elastic member so that the head portion is fixed to the bracket
Data Source
AI summary
A heat sink fastening structure includes a push pin to fasten a heat sink to a printed circuit board (PCB) and including a head portion formed at an end thereof, a bracket mounted on the PCB and including a through hole formed at a central portion thereof to allow the head portion to penetrate, and an accommodating hole included in the PCB to accommodate the head portion therein, and the head portion is configured to penetrate the through hole and thereafter be accommodated in the accommodating hole, to thereby be fixed to the bracket.