PCB Heat Sink Traces for Thermal Dissipation
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Solution Overview
Problem
Conventional passive cooling techniques for electronic components, such as printed circuit boards, are inadequate in managing the increasing heat generated by complex IC chips and circuitry, especially in portable devices where space constraints limit the use of active cooling components.
Innovation Solution
A multi-layer printed circuit board assembly with radially extending heat sink traces on a ground layer, electrically insulated from signal traces, to efficiently direct and dissipate heat generated by IC chips, both within the board and to the housing for ambient convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional passive cooling techniques are used, then the structure remains simple, but thermal dissipation becomes inadequate for complex IC chips
Solution Approach 1:
The patent transitions from conventional 2D surface-mounted heat sinks to 3D vertically-extending heat sink traces that penetrate through the PCB layers. This dimensional change allows heat to be dissipated in multiple directions (upward, downward, and laterally) simultaneously, significantly improving thermal dissipation capability without requiring additional active cooling components or increasing overall device complexity
Solution Approach 2:
The heat sink function is segmented into multiple independent conductive traces distributed across different PCB layers. Each trace acts as an independent heat dissipation pathway, allowing heat to be distributed and dissipated through multiple parallel channels rather than relying on a single large heat sink structure, thereby improving overall thermal management efficiency
2Temperature
If active cooling components are used, then thermal dissipation improves, but space constraints in portable devices are violated
Solution Approach 1:
The PCB ground layers and power layers are made multi-functional by configuring them to serve both their original electrical functions and additional thermal dissipation functions. The conductive traces in these layers act as heat sinks, allowing the PCB structure itself to perform dual roles: electrical signal/power distribution and thermal management, thereby eliminating the need for separate active cooling components that would consume valuable device volume
Solution Approach 2:
The PCB structure provides its own thermal dissipation capability through the conductive traces formed within its layers. The ground and power layers, which are already present for electrical functionality, are configured to automatically conduct heat away from IC chips without requiring external cooling components. The PCB serves itself for both electrical and thermal management functions
3Temperature
If heat sink traces extend through insulating layers, then heat transport efficiency improves, but electrical insulation requirements increase complexity
Solution Approach 1:
The heat sink traces are merged with the existing ground layers and power layers of the PCB. By forming conductive traces within the ground and power layers, the patent combines the thermal conduction function with the existing electrical infrastructure. The insulating layers between PCB signal layers are utilized as thermal pathways while maintaining electrical isolation, thereby achieving efficient heat transport without adding separate insulation structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages thermal dissipation by distributing heat away from critical components and to the housing, enhancing cooling efficiency without the need for active cooling components, thus addressing the limitations of conventional passive cooling methods.
Implementation Method 1
a first plurality of conductive traces formed on a power layer of the PCB, each of said conductive traces extending from a location of the IC package to a perimeter of the PCB
Implementation Method 2
transport of heat from one location on or in the component to another location on or off the component
Data Source
AI summary
Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board).