PCB Heat Dissipation Structure for Connector Warpage Control
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Solution Overview
Problem
Current heat dissipation structures for electronic devices face challenges in effectively managing heat distribution and warpage around control chips and connectors, particularly when integrating optical engines and electrical-signal connectors on printed circuit boards, which can lead to reduced efficiency and increased costs due to the need for frequent upgrades.
Innovation Solution
A heat dissipation structure comprising a substrate with connector holders, clamps, a bracket, and a heat sink, where the clamps provide elastic pressure to secure connectors, the bracket offers locking holes for the heat sink, and a stiffener on the substrate's surface enhances rigidity and heat conduction, allowing for improved heat dissipation and reduced warpage without requiring extensive upgrades to the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to manage thermal issues around control chips and connectors, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated components: the bracket serves both as a structural support element and as a mounting structure for the heat sink, while clamps provide both mechanical retention of connectors and elastic pressure for thermal contact. This merging reduces the number of separate components needed, thereby improving heat dissipation without proportionally increasing device complexity.
Solution Approach 2:
The bracket is designed with universal functionality, serving as both a structural support element and a heat dissipation component through integrated heat sink mounting. The stiffener also provides dual functions of mechanical reinforcement and thermal conduction pathway. This multi-functionality allows the structure to address thermal management needs without adding dedicated separate components for each function.
2Reliability
If clamps with elastic structures are used to secure connectors to the substrate, then connector retention is improved, but manufacturing complexity increases
Solution Approach 1:
The clamps utilize elastic structures that change their physical state through parameter changes - specifically, the elastic material deforms under compression to provide continuous retention force. This allows the clamp to adapt to manufacturing tolerances and connector variations without requiring precision machining or complex adjustment mechanisms, thereby improving retention while maintaining ease of manufacture.
3Strength
If a stiffener is added to the substrate to reinforce strength and provide heat conduction, then structural rigidity is improved, but device complexity increases
Solution Approach 1:
The stiffener is designed to merge structural reinforcement and thermal management functions into a single integrated component. It provides mechanical strength to prevent substrate warpage while simultaneously serving as a heat conduction pathway from the control chip and connectors to the heat sink, thereby addressing multiple problems without proportionally increasing complexity.
Solution Approach 2:
The stiffener performs multiple functions: it reinforces the substrate mechanically to prevent warpage during assembly and operation, provides a rigid mounting surface for the heat sink, and acts as a thermal conduction pathway. This multi-functionality allows a single component to address structural and thermal management needs simultaneously.
4Temperature
If the heat sink is affixed through the bracket with locking holes, then heat dissipation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The bracket with locking holes provides a standardized interface that accommodates manufacturing tolerances through parameter variations in hole positioning and dimensions. This allows the heat sink to be securely mounted with reliable thermal contact without requiring extremely tight manufacturing precision, as the locking hole design inherently compensates for normal dimensional variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, reduces warpage, and increases the structural rigidity of the substrate, promoting better thermal management while minimizing the need for costly upgrades to the printed circuit board infrastructure.
Implementation Method 1
The heat sink is affixed to the substrate through the locking holes of the bracket, and in contact with the control chip and the connectors on the substrate
Implementation Method 2
The clamps are provided with a plurality of elastic structures to respectively elastically press the upper surfaces of the connectors
Implementation Method 3
The second surface of the substrate is provided with a stiffener to reinforce the strength of the substrate and provide heat conduction
Data Source
AI summary
A heat dissipation structure of an electronic device is provided. The heat dissipation structure includes a substrate, connectors, clamps, a bracket and a heat sink. The substrate has a first surface and a second surface, and the first surface is provided with a control chip and connector holders. The connectors are disposed on the connector holders of the substrate. The clamps are used to affix the connectors to the substrate. The bracket is affixed to the substrate and has locking holes. The heat sink is affixed to the substrate through the locking holes of the bracket. The clamps are provided with elastic structures to respectively elastically press the upper surfaces of the connectors. The second surface of the substrate is provided with a stiffener to reinforce the strength of the substrate and provide heat conduction.