PCB Heat Transfer Member with Inverted Surface Geometry

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Heat transfer members with recessed surfaces can damage the insulating layer of printed circuit boards, impairing insulation and heat transfer performance when used for dissipating heat from electronic components.

Innovation Solution

A printed circuit board design featuring a heat transfer member with a protruding surface and recessed surface, where the protruding surface is in contact with the insulating layer to facilitate heat transfer and the recessed surface is exposed to prevent damage to the insulating layer, ensuring efficient heat dissipation without compromising insulation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the heat transfer member is stamped out to form a predetermined shape, then the manufacturing ease is improved, but the burr formation damages the insulating layer and impairs insulation performance

Engineering Contradiction:

Improveheat transfer member formationVSAvoidinsulation performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent inverts the conventional approach by exposing the recessed surface (with burr) to the outside rather than placing it against the insulating layer. The protruding surface (with shear droop) contacts the insulating layer, reversing which surface faces which component to prevent damage while maintaining manufacturing simplicity

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent converts the harmful burr, which normally damages the insulating layer, into a beneficial feature by exposing it to the outside where it can be removed or utilized. The burr on the recessed surface facing outward can be easily removed without affecting the insulating layer, transforming a defect into a non-problematic feature

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Object-affected harmful factors

If the recessed surface with burr faces the electronic component, then the solder can be prevented from flowing out, but the burr damages the insulating layer and impairs heat transfer performance

Engineering Contradiction:

Improvesolder flow preventionVSAvoidheat transfer performance

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent inverts the surface orientation by making the protruding surface (with shear droop) face the insulating layer and the recessed surface (with burr) face outward. This inversion prevents the burr from contacting and damaging the insulating layer while maintaining solder containment through the protruding surface geometry

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If the protruding surface with shear droop contacts the insulating layer, then the heat transfer efficiency is improved, but the shear droop may cause manufacturing precision issues

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidsurface flatness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by using the shear droop feature only where needed - on the protruding surface that contacts the insulating layer for heat transfer enhancement - while keeping the recessed surface with burr exposed outward where precision is less critical. This localized application optimizes heat transfer without requiring high precision across the entire component

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for efficient heat dissipation from electronic components while maintaining the insulation integrity of the printed circuit board, preventing damage to the insulating layer and ensuring effective thermal management.

Implementation Method 1

Heat generated by the electronic component is thereby transferred to the heat dissipation member through the solder, the heat transfer member and the heat transfer material, and is dissipated from the heat dissipation member to the outside

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS9769916B2Printed circuit board and electronic device

Publication Date: 2017.09.19 AIKOKIKI MFG CO LTD

AI summary

A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.