PCB Heat-Dissipating Structure With Conductive Void Coverage
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Solution Overview
Problem
Void formation between a printed circuit board and a multilayer resin sheet can lead to deteriorated insulation properties due to irregularities and different potentials on the plate surface, causing partial discharge.
Innovation Solution
A heat-dissipating structure with a plate-shaped heat transfer member and a conductive layer disposed between a board and a resin layer, where the conductive layer covers the voids formed by the board, resin layer, and heat transfer member, enhancing adhesion and insulation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a multilayer resin sheet is attached to a plate surface of a printed circuit board having large irregularities and different potentials, then heat dissipation is achieved, but voids are formed between the printed circuit board and the resin sheet, deteriorating insulation properties
Solution Approach 1:
A conductive layer is introduced as an intermediary between the resin layer and the printed circuit board. This conductive layer fills and covers the voids formed due to surface irregularities, preventing partial discharge while allowing heat to be transferred from the heating element through the resin layer to the heat dissipation member. The conductive layer thus mediates between the conflicting requirements of maintaining insulation and enabling heat dissipation.
Solution Approach 2:
The structure employs a composite configuration consisting of multiple layers with different properties: a resin layer for heat dissipation, a conductive layer for filling voids and preventing discharge, and a printed circuit board with heating elements. This composite structure combines the thermal management functionality of the resin with the electrical conductivity and structural support of the PCB, resolving the contradiction between heat dissipation and insulation.
2Device complexity
If a void is formed between the printed circuit board and the resin sheet, then heat dissipation structure is simplified, but partial discharge occurs due to deteriorated insulation properties
Solution Approach 1:
The conductive layer serves as a mediator that addresses the harmful effect of partial discharge in voids without significantly increasing structural complexity. By placing this thin conductive layer between the resin and the PCB, the structure maintains relative simplicity while effectively preventing discharge through the voids, thus resolving the contradiction between structural simplicity and discharge prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure suppresses partial discharge by covering voids with a conductive layer, resulting in a heat-dissipating structure with high insulation properties.
Implementation Method 1
at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer
Data Source
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AI summary
A heat-dissipating structure includes a board configured to be attached to a heating element, a resin layer provided between the board and a heat dissipation member, the resin layer being attached to the board, and at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer. The at least one heat transfer portion includes a heat transfer member, which is plate-shaped, provided between the board and the resin layer, the heat transfer member extending along the board, and a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer.