PCB Heating Circuit for Cold-Start Semiconductor Chips

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Solution Overview

Problem

Commercial grade semiconductor chips malfunction in environments below 0°C due to operating outside their specified temperature range, leading to potential system failures, and using military grade chips is costly.

Innovation Solution

A heating element integrated into the electronic circuit board, controlled by a power management integrated circuit (PMIC), warms the chips to their minimum operating temperature before full system operation, using pulse-width-modulated signals to manage heat application and prevent thermal shock.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If commercial grade semiconductor chips are used in cold environments below 0°C, then cost is reduced, but the chips malfunction due to operating outside their specified temperature range

Engineering Contradiction:

Improvechip operation reliabilityVSAvoidcold environment effect

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The heating element is activated before the semiconductor chip is operated to pre-warm the chip and bring it within its specified operating temperature range. This preliminary heating action prevents the chip from malfunctioning due to cold temperatures, allowing reliable operation of commercial grade chips in cold environments.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A heating element serves as an intermediary component between the cold environment and the semiconductor chip. This intermediary provides thermal energy to the chip, mediating the harmful cold environment effect and enabling the chip to operate reliably without requiring expensive military grade components.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If military grade semiconductor chips are used to operate in cold environments, then reliability is improved, but cost increases significantly

Engineering Contradiction:

Improvechip operation reliabilityVSAvoidsystem cost

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

Instead of using expensive military grade semiconductor chips designed for cold environments, the patent uses a cheap commercial grade chip combined with a heating element. The heating element is a simple, low-cost component that temporarily provides the necessary thermal conditions, replacing the need for expensive specialized chips.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the temperature parameter of the commercial grade semiconductor chip by introducing a heating element. This parameter change allows the chip to operate within its specified temperature range even in cold environments, eliminating the need for expensive military grade chips while maintaining reliability.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If heating is applied to warm the chip in cold environments, then temperature is improved, but thermal shock may occur if not controlled properly

Engineering Contradiction:

Improvechip temperatureVSAvoidthermal shock

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The heating element is controlled to provide periodic or staged heating rather than continuous maximum heating. This controlled heating approach allows the chip temperature to gradually increase to the operating range, preventing thermal shock while still achieving the necessary temperature improvement.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures reliable operation of commercial grade chips in cold environments by maintaining them within their specified temperature range, avoiding malfunctions and reducing costs compared to military grade chips.

Implementation Method 1

A heating element integrated into the electronic circuit board, controlled by a power management integrated circuit (PMIC), warms the chips to their minimum operating temperature

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

using pulse-width-modulated signals to manage heat application and prevent thermal shock

Methodology Applied

Scientific EffectThermal shock: Thermal Shock

Data Source

PatentUS12489026B2Heating element and supporting circuitry for adapting a nominally rated semiconductor chip to an extremely cold environment

Publication Date: 2025.12.02 INTEL CORP

AI summary

A thermal control circuit is described. The thermal control circuit includes a heating element disposed within an electronic circuit board having a semiconductor chip disposed thereon. The thermal control circuit includes a power management integrated circuit coupled to the heating element. The power management integrated circuit is to enable the heating element to heat the semiconductor chip at least to the semiconductor chips' lowest rated operating temperature prior to the semiconductor chip being placed in a fully operational state.