PCB Heating Line Design for Fluid Heaters to Reduce Device Complexity

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Solution Overview

Problem

Existing fluid heaters with power semiconductors as heating elements require significant effort and costly equipment for areal heat transfer, due to complex interconnection and high prices of semiconductors, making them inefficient compared to conventional tubular heating elements.

Innovation Solution

A printed circuit board with heating lines formed by conducting paths via a subtractive process, such as etching, allowing for adaptable heating power and reduced circuitry-related effort, where the heat dispersion layer is integrated into the board structure for improved heat transfer, and the parasitic heating effect is utilized for efficient heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If power semiconductors are used as heating elements, then heating function is achieved, but device complexity and cost increase significantly

Engineering Contradiction:

Improveheating powerVSAvoidcircuit complexity

Core Design Contradiction:

PowerVSDevice complexity

Solution Approach 1:

The printed circuit board serves dual functions: it provides control/power electronics functionality and acts as a heating element through its conducting paths. The conducting paths on the PCB are designed to generate heat when current flows through them, eliminating the need for separate power semiconductor heating elements and reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the heating function with the control electronics by integrating heating lines directly into the printed circuit board structure. This combines previously separate components (heating elements and control circuitry) into a single integrated unit, reducing component count and simplifying the overall device architecture.

Inventive Principle:

Principle #5Merging (Combining)

2Power

If power semiconductors are used for heating, then heating function is provided, but manufacturing cost increases

Engineering Contradiction:

Improveheating powerVSAvoidmanufacturing cost

Core Design Contradiction:

PowerVSEase of manufacture

Solution Approach 1:

The invention replaces expensive power semiconductor heating elements with inexpensive conducting paths formed on the printed circuit board using standard PCB manufacturing techniques. The conducting paths are created through conventional processes like copper deposition and etching, which are much cheaper than sourcing and mounting power semiconductor devices.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

Instead of using expensive power semiconductors, the invention uses standard PCB conducting paths that replicate the electrical connectivity function while adding heating capability. The conducting paths copy the trace routing patterns but serve dual purposes as both electrical connections and heating elements.

Inventive Principle:

Principle #26Copying

3Power

If power semiconductors are used as heating elements, then localized heating is achieved, but heat distribution efficiency decreases

Engineering Contradiction:

Improveheating powerVSAvoidheat transfer efficiency

Core Design Contradiction:

PowerVSLoss of energy

Solution Approach 1:

The conducting paths on the printed circuit board are strategically designed with varying geometries to create different heating zones. By adjusting the path width, length, and routing patterns in different areas, the invention achieves localized heating where needed while maintaining overall heat distribution efficiency across the entire board surface.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables effective and uniform heating of fluids with reduced effort and cost, as the printed circuit board can be easily configured for different heating powers and integrates heat dispersion, simplifying manufacturing and reducing device-related effort.

Implementation Method 1

at least one heating line (58, 60) configured for a predetermined heating power for heating a fluid... whose cross-section, length, and material are designed according to the heating resistance required for the heating power

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

The printed circuit board is configured with a heat dispersion layer for heat transfer to the fluid

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20220377877A1Printed circuit board and fluid heater

Publication Date: 2022.11.24 DAVID & BAADER DBK GMBH

AI summary

A printed circuit board includes a conducting path shaped via a subtractive method and a heating line. The heating line is formed by the conducting path and designed to have a predetermined heating power for a heating fluid. The printed circuit board further includes a heat dispersion layer designed for transferring heat to the fluid. A heater includes such a printed circuit board.