PCB Internal Heatsinks via Conjoined Thermal Vias
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Solution Overview
Problem
As data rates and processing chip sizes increase, heat dissipation in information handling systems becomes increasingly difficult, with conventional fans and air flow being insufficient for effective heat dissipation.
Innovation Solution
A printed circuit board (PCB) design that incorporates internal heatsinks formed by connecting previously unused ground pads across multiple layers, creating thermal pads that dissipate heat away from processing units through the PCB, enhancing heat removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans and air flow are used for heat dissipation, then cooling is provided, but heat dissipation becomes insufficient for high-density processing chips
Solution Approach 1:
The patent transitions from conventional external cooling (fans/air flow) to internal multi-layer PCB cooling by utilizing the vertical dimension of the PCB structure. Multiple internal layers are configured as heatsinks with thermal vias conducting heat away from the processing chip through the PCB thickness, effectively adding a third dimension to the heat dissipation pathway.
Solution Approach 2:
The patent embeds cooling functionality within the PCB structure itself by nesting heatsink layers and thermal vias inside the PCB multi-layer construction. The processing chip is mounted on the PCB, and heat is conducted through integrated thermal pathways nested within the PCB layers, creating a compact nested cooling system.
2Productivity
If data rate and processing chip sizes are increased, then processing capability is improved, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The patent segments the heat dissipation function across multiple PCB layers, with each layer containing thermal vias and heatsink structures. This segmentation distributes the heat conduction pathway throughout the PCB multi-layer structure, allowing efficient heat removal from high-density processing chips without concentrating thermal load in a single location.
Solution Approach 2:
The patent introduces thermal vias and internal PCB layers as intermediary structures between the processing chip and the external environment. These intermediaries conduct heat away from the chip through the PCB interior, acting as a thermal bridge that facilitates heat transfer from the high-density chip to external heatsinks or ambient air.
3Temperature
If conventional cooling methods are used, then simplicity is maintained, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent makes the PCB multi-functional by integrating both electrical signal transmission and thermal management functions into a single structure. The same PCB layers that provide electrical connectivity also serve as thermal conduction pathways, eliminating the need for separate cooling components and reducing overall system complexity while improving heat dissipation efficiency.
Solution Approach 2:
The patent merges the cooling function with the PCB structure by combining thermal vias, heatsink layers, and electrical traces into a unified multi-layer PCB design. This consolidation integrates heat dissipation capabilities directly into the PCB, eliminating the need for separate cooling components and simplifying the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the efficiency of heat removal from the PCB, effectively addressing the challenge of heat dissipation in high-density processing environments.
Implementation Method 1
a first pad is conjoined with a second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit
Data Source
AI summary
A printed circuit board (PCB), including: a processing unit; a plurality of layers; and a plurality of vias, each via extending through two or more of the layers, wherein a first via of the plurality of vias has a first pad at a first layer of the plurality of layers and a second via of the plurality of vias has a second pad at the first layer of the plurality of layers, wherein the first pad is conjoined with the second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit.