Measurement Position Determination for PCB Height Accuracy

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Solution Overview

Problem

Conventional component mounting machines face errors in measuring board height due to the presence of components already mounted at measurement points, leading to inaccurate height measurements.

Innovation Solution

A measurement position determination device that identifies scheduled mounting positions on a board and determines temporary measurement positions closest to these, ensuring accurate board height measurement by avoiding pre-mounted components, thereby reducing measurement errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If measurement points are set in a grid pattern on the board, then measurement coverage is improved, but measurement accuracy deteriorates when components are already mounted at measurement points

Engineering Contradiction:

Improvemeasurement coverage areaVSAvoidboard height measurement accuracy

Core Design Contradiction:

Area of stationary objectVSMeasurement precision

Solution Approach 1:

The system performs preliminary action by determining measurement positions based on the component mounting plan before actual measurement takes place. The measurement position determination section acquires scheduled mounting positions and selects appropriate measurement points that avoid areas where components will be mounted, preventing measurement errors before they occur.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system applies local quality by making measurement positions non-uniform and adaptive rather than using a fixed grid pattern. Instead of uniform grid measurements, the system selectively determines measurement positions based on local conditions (component mounting locations), making measurements concentrated in areas free of components while avoiding areas where components will be mounted.

Inventive Principle:

Principle #3Local quality

2Productivity

If components are mounted at measurement points, then component mounting functionality is improved, but board height measurement accuracy deteriorates

Engineering Contradiction:

Improvecomponent mounting efficiencyVSAvoidboard height measurement accuracy

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The system applies segmentation by separating the board surface into measurement regions and component mounting regions. The measurement position determination section divides the board area into zones suitable for measurement (free of components) and zones for component mounting, allowing both functions to coexist without interference by selecting measurement points from appropriate segments.

Inventive Principle:

Principle #1Segmentation

3Ease of operation

If fixed grid measurement points are used, then measurement process simplicity is improved, but adaptability to component layouts deteriorates

Engineering Contradiction:

Improvemeasurement process simplicityVSAvoidadaptability to component mounting layouts

Core Design Contradiction:

Ease of operationVSAdaptability or versatility

Solution Approach 1:

The system applies dynamics by making measurement positions variable and adaptive rather than fixed. The measurement position determination section dynamically selects measurement positions based on the specific component mounting plan and board layout, allowing the measurement system to adapt to different component arrangements while maintaining measurement accuracy.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentEP3634099B1Measurement position determination device

Publication Date: 2023.03.15 FUJI CORP

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AI summary

The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height.