Printed Wiring Board With High Conductivity Outer Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing printed wiring boards face challenges in efficiently dissipating heat and maintaining connection reliability when embedding a large number of P-type and N-type thermoelectric elements, as they expand or contract, while also requiring a compact design.
Innovation Solution
A printed wiring board design featuring a core substrate with an opening that accommodates P-type and N-type thermoelectric elements, surrounded by a first build-up layer with a high thermal conductivity outermost resin insulating layer and a second build-up layer with an even higher thermal conductivity, along with via conductors that connect the elements effectively, forming a heat-insulation structure for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thermoelectric elements are embedded in the core substrate to achieve compact design, then the device size is reduced, but connection reliability deteriorates due to expansion and contraction of the elements
Solution Approach 1:
The patent divides the build-up structure into multiple resin insulating layers (first resin insulating layer, second resin insulating layer, etc.) with via conductors connecting them. This segmentation allows each layer to independently accommodate the expansion and contraction of thermoelectric elements, preventing stress concentration and maintaining connection reliability while keeping the overall device compact.
Solution Approach 2:
The patent uses composite resin insulating layers with different thermal conductivities. The outermost resin insulating layers have higher thermal conductivity than inner layers, creating a composite structure that optimizes both thermal management and mechanical flexibility to handle thermoelectric element expansion/contraction.
2Volume of moving object
If multiple thermoelectric elements are accommodated in a single opening, then device compactness is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent applies local quality by making the outermost resin insulating layers have higher thermal conductivity than the inner resin insulating layers. This creates a gradient heat dissipation structure where heat is efficiently conducted away from the thermoelectric elements at critical locations, maintaining heat dissipation efficiency while accommodating multiple elements in a compact opening.
3Ease of manufacture
If resin insulating layers with uniform thermal conductivity are used, then manufacturing simplicity is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The patent implements local quality by assigning different thermal conductivity values to different resin insulating layers. The outermost layers have higher thermal conductivity for efficient heat dissipation, while inner layers have lower thermal conductivity. This differentiated design optimizes heat dissipation performance while remaining manufacturable through standard lamination processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and connection reliability, allowing for a compact printed wiring board that efficiently transfers heat from heat-generating elements to heat-absorbing elements, even when the thermoelectric elements expand or contract.
Implementation Method 1
The first build-up layer is formed so that the outermost first resin insulating layer has a thermal conductivity that is higher than a thermal conductivity of the first resin insulating layer and a thermal conductivity of the core material
Implementation Method 2
thermoelectric elements including P-type thermoelectric elements and N-type thermoelectric elements
Data Source
AI summary
A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.