PCB High-Voltage Power Routing With Package-Substrate Regulators

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional printed circuit boards (PCBs) experience significant power loss and require numerous planes due to operating at low voltages, leading to increased complexity and cost.

Innovation Solution

The high power voltage regulator is relocated from the PCB to the package substrate, allowing power to be routed at a higher voltage, reducing current demand and minimizing power loss, heat dissipation, and the number of capacitors on the PCB.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If conventional PCBs operate at low voltages, then current draw increases to maintain power, but power loss increases and more planes are required

Engineering Contradiction:

Improvepower delivery capabilityVSAvoidpower loss

Core Design Contradiction:

PowerVSLoss of energy

Solution Approach 1:

The patent changes the voltage parameter from conventional low voltage (e.g., 3.3V, 5V) to high voltage (e.g., 100V, 200V, or higher) operation on the PCB. This parameter change allows the same power to be delivered with much lower current (P=IV), thereby reducing power loss (P_loss=I²R) significantly while maintaining the required power delivery capability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent inverts the conventional approach by placing high-power voltage regulators directly on the PCB instead of using multiple lower-voltage regulators. This inversion allows single high-voltage power delivery paths instead of multiple low-voltage paths, reducing the number of planes required while delivering the same or greater power with lower loss.

Inventive Principle:

Principle #13The other way round (Inversion)

2Loss of energy

If conventional PCBs operate at low voltages, then more planes are required to reduce resistance, but device complexity increases

Engineering Contradiction:

Improvepower lossVSAvoidnumber of PCB planes

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

By changing the operating voltage parameter to high voltage, the patent reduces the current required for power delivery. This allows the use of fewer PCB planes with higher impedance traces instead of requiring multiple low-impedance planes, thereby reducing device complexity while maintaining low power loss.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent inverts the conventional multi-plane low-voltage architecture into a simpler high-voltage architecture with fewer planes. High-voltage traces can tolerate higher impedance and require fewer redundant planes for power delivery, simplifying the overall PCB design while reducing power loss.

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentUS20250006713A1High voltage power transfer on printed circuit board

Publication Date: 2025.01.02 INTEL CORP

AI summary

Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.