Holder Soldering on PCB Through-Holes for Automated Assembly
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Solution Overview
Problem
The manual insertion and fixation of holders onto printed circuit boards is time-consuming and labor-intensive, requiring significant manpower and time, especially when precise spacing and electrical connections are necessary between components like light guide plates and diffuser plates or shield covers and printed circuit boards.
Innovation Solution
An electronic apparatus featuring a printed circuit board with through-holes and a holder that automatically inserts and is bonded to the board using a solder layer, where the holder includes a connecting member that covers the through-hole and extends to the periphery of the printed circuit board, facilitating both physical and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual insertion method is used to fix the holder to the printed circuit board, then the holder can be securely fixed, but it takes a lot of time and manpower
Solution Approach 1:
The patent replaces the manual mechanical insertion method with an automated soldering system. The holder is positioned through the through-hole and then bonded using a solder layer applied through the same hole, eliminating the need for manual insertion while ensuring secure fixation through automated soldering processes.
Solution Approach 2:
The holder structure itself facilitates the bonding process by being positioned through the through-hole, which then serves as the pathway for applying the solder layer. The same structural feature (through-hole positioning) enables both the mechanical placement and the subsequent automated soldering operation.
2Productivity
If automated insertion is implemented, then assembly time and labor are reduced, but additional bonding processes are required
Solution Approach 1:
The patent combines the positioning function and the bonding function into a single integrated process. The through-hole serves dual purposes: it positions the holder during automated insertion and simultaneously serves as the pathway for applying the solder layer, merging two operations into one streamlined process.
Solution Approach 2:
The solder layer acts as an intermediary bonding agent that connects the holder to the printed circuit board. This intermediary material enables reliable electrical and mechanical connection while allowing the automated insertion process to proceed without direct mechanical fastening.
3Adaptability or versatility
If the holder is made to protrude upward and downward from the printed circuit board, then it can support components at spaced distances, but the structure becomes more complex
Solution Approach 1:
The holder structure performs multiple functions: it provides mechanical support for components at spaced distances, enables automated positioning through the through-hole, and serves as a substrate for the solder layer. This multi-functional design reduces the need for separate support structures.
Solution Approach 2:
The holder is divided into segments that protrude upward and downward from the printed circuit board, allowing it to support different components at different heights and positions. This segmentation enables flexible component placement while maintaining a relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution automates the holder attachment process, reducing the time and manpower required for assembly while ensuring stable and precise positioning and electrical connectivity, thereby enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
a solder layer configured to bond one area of the holder to one surface of the printed circuit board
Data Source
AI summary
An electronic device is disclosed. The disclosed electronic device includes a printed circuit board including at least one through-hole, a holder which is positioned through the through-hole and protrudes upward and downward from the printed circuit board, and a solder layer for bonding one area of the holder to one surface of the printed circuit board.