PCB Holder Eliminates Solder Joint Stress During Heat Dissipation
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Solution Overview
Problem
Traditional methods of attaching high-power electronic devices to printed circuit boards for heat dissipation using resilient fastening sheets and screws can generate tensile stress at solder joints, damage the device, and limit layout flexibility, reducing product competitiveness due to space constraints and reduced structural density.
Innovation Solution
A holder is disposed between the printed circuit board and the heat-dissipation device to support the electronic device, eliminating stress on pins and maintaining the device at a fixed position, while allowing for unrestricted placement of other components and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the electronic device is fastened through the resilient fastening sheet and the screw, then the electronic device is closely attached to the heat-dissipation surface, but tensile stress is generated at the solder joints and the structural body may be damaged
Solution Approach 1:
A holder is introduced as an intermediary component between the electronic device and the resilient fastening sheet. The holder receives the fastening force from the screw and resilient fastening sheet, while the electronic device is attached to the holder without direct fastening. This mediator structure transmits the clamping force away from the solder joints, preventing tensile stress concentration while maintaining effective heat dissipation through the attachment of the electronic device to the heat-dissipation surface via the holder.
2Temperature
If the electronic device is horizontally plugged on the printed circuit board, then the device can be attached to the heat-dissipation surface, but the layout area for other components is occupied and the product size increases
Solution Approach 1:
The holder extends vertically from the printed circuit board surface, utilizing the third dimension (height) to achieve heat dissipation functionality. By attaching the electronic device to the holder in a vertical configuration rather than horizontal placement on the PCB plane, the design frees up valuable PCB layout area for other components while maintaining effective heat dissipation through the vertical attachment to the heat-dissipation surface.
3Area of stationary object
If the electronic device is vertically plugged on the printed circuit board, then space is saved on the printed circuit board, but sufficient operating space is required for the resilient fastening sheet and screw
Solution Approach 1:
The holder serves as an intermediary that simplifies the fastening process. Instead of requiring complex operations to attach the resilient fastening sheet and screw directly to a vertically plugged electronic device, the holder provides a standardized interface that receives these fastening components. This mediator structure reduces the operational complexity by creating a clear assembly sequence: first attach the electronic device to the holder, then fasten the holder to the heat-dissipation surface using the screw and resilient fastening sheet.
4Reliability
If the electronic device is soldered on the printed circuit board, then the device is electrically connected, but further fastening through resilient fastening sheet and screw generates tensile stress at the solder joints
Solution Approach 1:
The attachment system is segmented into distinct functional zones: the solder joints provide electrical connection between the electronic device pins and the printed circuit board, while the holder and resilient fastening sheet provide mechanical attachment and heat dissipation. This segmentation allows the solder joints to focus solely on electrical connectivity without bearing mechanical fastening loads, while the holder structure handles all mechanical stress and clamping forces separately.
Data Source
AI summary
A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.