PCB In-Line Region for Semiconductor Package Manufacturing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The manufacturing process of semiconductor packages is inefficient and costly due to complex processes and the need for multiple operations such as program downloading and testing, which can be time-consuming and require additional terminals for commanding operation modes.

Innovation Solution

A printed circuit board design with an in-line PCB region and a main PCB region, featuring input/output control signal generation units that change states based on electrical connections, allowing for simplified manufacturing by altering input/output control signals to manage operation modes and program types before and after separation from the board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a traditional manufacturing process is used for semiconductor packages, then the process can handle complex operations, but the manufacturing efficiency is low and the process is time-consuming

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidtime taken for program downloading and testing
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent implements preliminary action by providing different types of programs (first type and second type) to the semiconductor chip at different stages: before separation from the printed circuit board and after separation. This allows the chip to be pre-configured with initial programs during manufacturing, eliminating the need for time-consuming program downloading operations after the product reaches the customer, thereby significantly reducing manufacturing time and improving productivity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies dynamics by making the input/output control signals changeable based on the operational stage. The control signals dynamically switch between different states to provide different program types to the semiconductor chip depending on whether it is before or after separation from the board. This dynamic control mechanism enables flexible manufacturing processes that adapt to different stages, improving overall manufacturing efficiency while reducing time consumption

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If additional terminals are used for commanding operation modes during manufacturing, then the control functionality is enhanced, but the device complexity increases

Engineering Contradiction:
Improveoperation mode control capabilityVSAvoidnumber of additional terminals required
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements universality by making existing input/output control signals serve multiple functions. These control signals not only perform their standard I/O functions but also dynamically provide operation mode control and program type selection based on the manufacturing stage. By making existing components multi-functional, the patent enhances control capability without adding additional terminals, thereby maintaining simplicity while improving adaptability

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9674958B2Printed circuit boards and semiconductor packages
Publication Date: 2017.06.06 SAMSUNG ELECTRONICS CO LTD
  • US9674958B2 patent drawing
  • US9674958B2 patent drawing
  • US9674958B2 patent drawing

AI summary

A printed circuit board includes an in-line PCB region comprising an input/output control region including a first conductive line, and a main PCB region coupled to the in-line PCB region and comprising a semiconductor chip and an input/output signal generation region including a second conductive line. The input/output signal generation region is configured to detect whether or not the first and second conductive lines are electrically connected and to provide an input/output control signal to the semiconductor chip in response to determining whether or not the first and second conductive lines are electrically connected.