Printed Wiring Board With Independent Capacitors For Multicore Processors
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Solution Overview
Problem
Multicore processors on printed wiring boards face issues with instantaneous voltage drops, which can cause malfunctioning due to shared voltage variations among processor cores, and existing solutions do not effectively isolate and decouple the power supply lines effectively.
Innovation Solution
A printed wiring board design with independently provided power supply lines, ground lines, and layered capacitors for each processor core, using high-dielectric ceramic layers to enhance capacitance and decoupling, and a stress relief portion made of elastic material to manage thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common layered capacitor is shared among multiple processor cores, then the device complexity is reduced, but voltage variations affect multiple cores causing malfunctioning
Solution Approach 1:
The patent divides the common capacitor into multiple independent layered capacitors, with each capacitor dedicated to a specific processor core. This segmentation isolates voltage variations to individual cores, preventing malfunctioning while maintaining manageable device complexity through systematic arrangement.
Solution Approach 2:
Each processor core is provided with its own dedicated layered capacitor with specific power supply lines and ground lines, creating localized decoupling structures. This local quality approach ensures that voltage stability is optimized for each core independently without affecting other cores.
2Reliability
If independently provided power supply lines, ground lines, and layered capacitors are used for each processor core, then voltage stability is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple functionally independent elements (power supply lines, ground lines, and layered capacitors) into an integrated structure where each processor core has its dedicated set of components. This merging approach achieves voltage stability while managing complexity through unified structural design.
Solution Approach 2:
The layered capacitor structure serves multiple functions simultaneously: it provides decoupling capacitance, establishes reference potentials through ground lines, and supplies power through power supply lines. This multi-functionality reduces the need for separate components, managing device complexity while maintaining voltage stability.
3Reliability
If a ceramic high-dielectric layer is used to increase capacitance, then the decoupling effect is improved, but the manufacturing difficulty increases due to high sintering temperature requirements
Solution Approach 1:
The patent forms the ceramic high-dielectric layer by sintering at high temperature before assembling the complete layered capacitor structure with electrodes and insulating layers. This preliminary action of pre-sintering the ceramic layer allows subsequent low-temperature assembly processes, making the overall manufacturing feasible while maintaining the high capacitance benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses instantaneous voltage drops and prevents malfunctioning by isolating voltage variations among processor cores, achieving a satisfactory decoupling effect even at high frequencies and reducing the risk of power supply shortages and thermal stress-related issues.
Implementation Method 1
layered capacitors which are independently provided for each of the processor cores of the multicore processor, and in which one of an upper surface electrode and a lower surface electrode that sandwich a high-dielectric layer is connected to the power supply line of a predetermined processor core
Implementation Method 2
a stress relief portion made of elastic material to manage thermal stress
Data Source
AI summary
A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently provided for each of the processor cores, respectively. Accordingly, even when the electric potentials of the processor cores instantaneously drop, an instantaneous drop of the electric potential can be suppressed by action of the layered capacitors corresponding to the processor cores, respectively. In addition, even when the voltage of one of the processor cores varies, the variation in the voltage does not affect the other processor core, and thus malfunctioning does not occur.