PCB Inductor Alignment Structure for Automated Assembly and Cooling

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Solution Overview

Problem

Existing manufacturing methods for common mode and differential mode inductors result in high tolerances and manual production, leading to increased costs, difficulty in robotizing the mounting and soldering process, and inefficient cooling systems in outdoor power supply systems.

Innovation Solution

A common mode or differential mode inductor design featuring a core with coils supported by a device including a base element and alignment elements, allowing for precise alignment and adhesive fastening, which simplifies manufacturing and integration with printed circuit boards, and incorporates a thermally conducting housing for improved cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If manual production methods are used for inductors, then manufacturing flexibility is maintained, but manufacturing precision deteriorates with high tolerances and variations

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidinductor dimensional tolerances
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The inductor is divided into separate modular components: a core, a supporting device with alignment elements, and coils. This segmentation allows each component to be manufactured independently with standard tolerances, while the assembly process achieves high precision through the alignment elements (alignment planes and positioning features) that ensure consistent relative positioning without requiring complex manual adjustment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces manual mechanical positioning and adjustment with a predefined mechanical alignment system consisting of alignment planes, positioning elements, and supporting devices. This substitution eliminates the need for skilled manual positioning while achieving consistent high-precision alignment through standardized mechanical features that guide component placement.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If automated production is implemented, then manufacturing precision improves, but device complexity increases due to specialized equipment requirements

Engineering Contradiction:
Improveinductor alignment accuracyVSAvoidproduction equipment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Alignment features (alignment planes, positioning elements) are built into the supporting device and core components during standard manufacturing processes. This preliminary preparation of alignment features allows subsequent automated assembly to proceed with simple pick-and-place operations, avoiding the need for complex specialized equipment while achieving high precision through pre-configured mechanical guides.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The supporting device serves multiple functions: it provides mechanical support for the core and coils, incorporates alignment elements for precise positioning, and facilitates automated assembly through standardized mounting features. This multi-functionality eliminates the need for separate specialized equipment for each operation, reducing overall device complexity while maintaining high manufacturing precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If cooling systems are added to converters, then temperature control improves, but power efficiency deteriorates due to additional energy consumption

Engineering Contradiction:
Improveconverter cooling effectivenessVSAvoidoverall power efficiency
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The inductor is integrated directly into the housing structure, with the housing serving dual purposes as both structural enclosure and thermal management component. The housing includes thermal pads that contact the inductor's core to conduct heat away, eliminating the need for separate active cooling systems and maintaining power efficiency while providing effective temperature control through passive thermal conduction.

Inventive Principle:
Principle #5Merging (Combining)

4Temperature

If thermal pads are used for cooling, then heat dissipation improves, but manufacturing complexity increases due to additional assembly steps

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidassembly procedure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The thermal management function is merged into the housing structure itself. The housing includes integrated thermal pads that are positioned to contact the inductor's core, combining structural support and thermal conduction functions in a single component. This integration eliminates separate thermal pad assembly steps and reduces manufacturing complexity while maintaining effective heat dissipation.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces manufacturing tolerances, simplifies the mounting and soldering process, and enhances cooling efficiency by aligning coils within the housing, reducing variations and the need for thermal pads, thus lowering costs and improving system reliability.

Implementation Method 1

incorporates a thermally conducting housing for improved cooling

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11908615B2Method for manufacturing common mode or differential mode inductor and common mode or differential mode inductor
Publication Date: 2024.02.20 ELTEK AS
  • US11908615B2 patent drawing
  • US11908615B2 patent drawing
  • US11908615B2 patent drawing

AI summary

The present disclosure provides a common or differential mode inductor for connection to a printed circuit board. The inductor includes a core, a first coil including a first insulated wire wound with a number of turns around the core, and a supporting device for supporting the core and the first coil. The supporting device includes a base element having a PCB contacting surface, and a first alignment element having a proximal end connected to the base element and a distal end provided at a distance from the PCB contacting surface, wherein the distal end is defining an alignment plane. The core has a first end plane facing the alignment plane and a second end plane, wherein the first end plane is facing the alignment plane. The second end plane is facing the base element.