Printed Wiring Board With Inductor Cavity For High Inductance
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Solution Overview
Problem
Existing printed wiring boards with built-in inductor components face challenges in achieving a balance between thinness and high inductance while maintaining electrical characteristics and mechanical stability, as well as efficient integration of inductor components with fine conductive circuits.
Innovation Solution
A printed wiring board design featuring a core substrate with opposing buildup layers, one containing a cavity to house an inductor device with resin insulation and coil layers, and a method for manufacturing this board that includes forming insulation and conductive layers, via conductors, and accommodating the inductor device within the cavity, allowing for reduced thickness and enhanced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thick metal sheet is used to manufacture the inductor component, then the inductance is increased, but the thickness of the printed wiring board increases
Solution Approach 1:
The inductor component is nested within a cavity formed in the buildup layer of the printed wiring board. This allows the inductor to be integrated within the board structure rather than being a separate external component, achieving high inductance while maintaining thin overall board thickness.
Solution Approach 2:
The inductor component is positioned in a cavity within the buildup layer, utilizing the vertical dimension (Z-axis) of the board structure. This three-dimensional integration allows the inductor to be embedded within the board thickness rather than adding to it, resolving the contradiction between inductance and board thickness.
2Length of moving object
If the inductor component is integrated into the buildup layer, then the board thickness is reduced, but the electrical characteristics and mechanical stability deteriorate
Solution Approach 1:
The buildup layer is formed with a cavity specifically positioned to accommodate the inductor component. This localized structural modification allows the inductor to be integrated without compromising the overall electrical characteristics and mechanical stability of the printed wiring board, as the cavity is strategically placed and sized.
Solution Approach 2:
The buildup layer is segmented to form a cavity that houses the inductor component. This segmentation allows the inductor to be integrated into the board structure while maintaining the integrity of the surrounding electrical circuits and mechanical structure, preventing deterioration of electrical characteristics and mechanical stability.
3Adaptability or versatility
If the inductor component is accommodated in the buildup layer, then fine conductive circuits can be integrated, but the manufacturing complexity increases
Solution Approach 1:
The formation of the cavity in the buildup layer and the integration of the inductor component are merged into a single manufacturing step. The cavity is formed and the inductor is accommodated simultaneously during the buildup layer formation process, eliminating separate manufacturing steps and reducing overall manufacturing complexity despite the integration of fine conductive circuits.
Solution Approach 2:
The cavity is formed in the buildup layer in advance, before the inductor component is mounted. This preliminary action allows the inductor to be seamlessly integrated into the board structure during subsequent manufacturing steps, facilitating the integration of fine conductive circuits without significantly increasing manufacturing complexity.
Data Source
AI summary
A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.